摘要
伴随着电子信息技术的快速发展,印制板中HDI板、FPC板以及IC载板的比重不断增加,导通孔孔径越来越小,亟需高性能极细微钻的开发。论文首先分析了印制板微孔发展趋势,然后对极细微钻的材质特性和磨损失效机制进行了研究。重点讨论了极细微钻的关键参数包括螺旋角、第一后角和顶角的设计原则,介绍了极细微钻辅助设计的CAE法以及高速钻削的温度监测和影像监测方法,为极细微钻的优化设计提供指导。论述了极细微钻的涂层技术,对涂层微钻和普通微钻的钻孔能力进行了对比。最后给出了直径0.105mm微钻的开发实例,通过试验对其钻削性能进行了验证。
With the development of electronics and information technology,the percentages of HDI,FPC and IC substrate among PCBs are increasing continuously and the hole diameter in these PCBs is becoming smaller and smaller.It is desirable to provide ultra small micro drill bit with superior performances.The development trend of micro hole in printed circuit board is presented first.Then the material properties of micro drill bit material are introduced and the wear failure mechanism of ultra small micro drill bit is studied.The design rules of key micro drill bit parameters including helix angle,primary face angle and point angle are disclosed.The CAE analysis,temperature monitoring and the video monitoring techniques in high speed drilling are employed to provide guidance on optimal design of ultra small drill bit.The coating technology of ultra small drill bit is proposed and the comparisons of drilling capabilities between the coated drill bit and ordinary drill bit are conducted.Finally,the design example of 0.105mm diameter micro bit is presented and verified via experiments.
出处
《印制电路信息》
2009年第S1期115-121,共7页
Printed Circuit Information
关键词
印制板
极细微钻
涂层微钻
printed circuit board
ultra small micro drill bit
coated micro drill bit
