摘要
采用显微硬度法,对单晶硅、多晶硅、蓝宝石三种重要的硬脆性材料进行了单颗金刚石加载实验,对比研究了不同加载载荷条件下,各种材料的单颗金刚石压入特性,分析了材料受力与压入深度的关系,并由测试结果,分析了对三种硬脆材料进行切割加工时,金刚石的受力状况以及材料的去除模式。
The single diamond grit loading experiments on photovoltaic materials namely monocrystalline silicon,polycrystalline silicon and sapphire are done by micro-hardness method. Loading characteristics with single diamond grit to these materials under different force are studied,and the relationship between the force and the loading deepness is analyzed. According to the test results,the diamond' s force state and these materials' carving models are analyzed when these materials are cut by diamond tool.
出处
《金刚石与磨料磨具工程》
CAS
2013年第4期38-40,共3页
Diamond & Abrasives Engineering
基金
广西青年基金面上项目(项目编号:2011GXNSFA018035)
关键词
金刚石
硬脆材料
显微硬度
diamond
hard and brittle material
micro-hardness
