摘要
F型封装集成电路属于大功率封装器件,通常为集成电路稳压器、分离器件、MOS器件等。此种器件体积大、功率大,容易受到振动、冲击环境的影响。阐述F型封装器件振动、冲击试验夹具需求的必要性,并从该试验夹具设计的总体方案、设计的工艺、特点、设计的优化、设计的结构、设计的实施方案,以及该试验载具的实现。
Type F packaging device belongs to high power package device,It is usually integrated circuit voltage regulator,separation devices,MOS devices,etc.This kind of device has large volume,high power and is easy to be affected by vibration and shock environment.This paper describes the necessity of F-type packaging device vibration,impact test fixture requirements,and from the overall design of the test fixture,design technology,characteristics,design optimization,design structure,design implementation plan of the test fixture described the realization.
作者
宋毅刚
刘思嘉
王宇
李泱
张湃
石帅
SONG Yigang;LIU Sijia;WANG Yu;LI Yang;ZHANG Pai;SHI Shuai(China Academy of Launch Vehicle Technology,Beijing 100076,China)
出处
《电子技术（上海）》
2021年第4期18-19,共2页
Electronic Technology
关键词
功率器件
夹具设计
振动与冲击
power device
fixture design
vibration and shock
