摘要
封装基板具有高密度、高精度、小型化及薄型化的特点。为实现上述产品特点,封装基板采用微孔导通及任意层互连技术,其孔径孔盘约50/100μm。在MSAP工艺下,实现微孔导通及任意层互连大致分三个步骤,分别是激光钻X型孔/盲孔、微孔与孔盘对准及叠孔垂直对准、图形填孔电镀。本文以50/100μm孔径孔盘微孔导通技术为研究对象,从超薄铜箔直接烧蚀工艺的激光钻孔参数、图形对位方式以及薄板图形填孔方式及参数等方面展开测试,最终获取相关制程参数,实现微孔导通技术,为量产封装基板奠定基础。
The packaging substrate has the characteristics of high density,high precision,miniaturization,and thinness.To achieve the above product features,the packaging substrate adopts microporous conductivity and arbitrary layer interconnection technology,with a pore size of approximately 50/100μm.Under the MSAP process,achieving micro hole conduction and arbitrary layer interconnection can be roughly divided into three steps:laser drilling of X-shaped holes/blind holes,alignment of micro holes with hole discs and vertical alignment of stacked holes,and pattern filling electroplating.This article focuses on the study of 50/100μm aperture perforated plate micro hole conductivity technology,and conducts tests on laser drilling parameters,graphic alignment methods,and thin plate graphic filling methods and parameters of ultra-thin copper foil direct ablation process.Finally,relevant process parameters are obtained to achieve micro hole conductivity technology,laying the foundation for mass production of packaging substrates.
作者
廉治华
樊廷慧
刘敏
Lian Zhihua;Fan Tinghui;Liu Min
出处
《印制电路信息》
2024年第S01期259-268,共10页
Printed Circuit Information
关键词
封装基板
MSAP
微孔导通
IC Substrate
MSAP
Microporous Conductivity
