摘要
随着半导体芯片向微细化、多端子、高速化,电子产品向轻、薄、小,高性能,多功能方向发展,要求采用的PCB及电子封装与之匹配,进而对二者在形式、结构、制作方法、加工工艺、特别是材料方面提出越来越高的要求。文章介绍了印制电路板和电子封装技术的最新发展动向。
Along with the development of IC chip to fine pitch, more I/O pins,high speed, as well as the electronic products to be lighter, thinner, smaller, with high properties and more performance, it is necessary for PCB and electronic package to match IC Chip and electronic products. Therefore the requirements to PCB and electronic package in the forms, structures, manufacture processes and technologies, particularly in the used materials, are more and more high. This paper introduces recent development trend of technologies.
出处
《印制电路信息》
2015年第10期10-15,48,共7页
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