摘要
电镀铜层具有良好的导电、导热、延展性等优点,因此,电镀铜技术被广泛应用于电子材料制造领域。本文概括了几种常用电镀铜体系的特点,重点介绍了在电子制造中应用较广的酸性硫酸盐电镀铜镀液的组成和各成分作用。简述了电镀铜在铜箔粗化、印制电路制作、电子封装、超大规模集成电路(ULSI)铜互连领域的应用,并对近年来电子工业中应用的几种先进电镀铜技术,包括脉冲电镀铜技术、水平直接电镀铜技术、超声波电镀铜技术、激光电镀铜技术等进行了评述。
Copper plating technology is widely applied to the field of electronic materials manufacturing for the good electrical conductibility, heat conductivity and ductility of copper deposit. The characteristics of several common copper plating baths were summarized. The components and their roles of the acidic sulfate copper plating bath widely used in electronic materials manufacturing were introduced emphatically. The apphcations of the copper plating in such areas as the roughening of copper foil, the manufacturing of PCB, electronic package and the copper interconnecting of ultra large scale integrated circuit were discussed briefly. Several advanced copper plating technologies used in electronic industry in recent years were also commented, including pulse copper plating technique, level and direct copper plating technique, ultrasonic copper plating technique and laser induced copper plating technique, and etc.
出处
《电镀与涂饰》
CAS
CSCD
2007年第2期43-47,共5页
Electroplating & Finishing
关键词
电子材料
电镀铜
铜箔粗化
印制电路
电子封装
超大规模集成电路(ULSI)
electronic material
copper plating
roughening of copper foil
printed circuit board
electronic package
ultra large scale integrated circuit
