对原位 As_4掺杂 MBE HgCdTe 材料退火前后的电学性质进行了研究。原生样品以及 N 型退火样品的测试结果显示,随着 As 掺杂进入 HgCdTe 的同时,样品中产生了额外的 Hg 空位,并且在样品中引进了一种 N 型深能级结构。不同 Hg 分压下的激...对原位 As_4掺杂 MBE HgCdTe 材料退火前后的电学性质进行了研究。原生样品以及 N 型退火样品的测试结果显示,随着 As 掺杂进入 HgCdTe 的同时,样品中产生了额外的 Hg 空位,并且在样品中引进了一种 N 型深能级结构。不同 Hg 分压下的激活退火结果显示,高温汞压下退火可以获得 P 型 MBE HgCdTe 材料。但是,真空退火结果显示 As 很难被激活。说明在激活退火过程中 As 在各个格点之间转移时,外界的 Hg 起重要作用。展开更多
Some results on the molecular-beam epitaxial growth of HgCdTe focusing on the requirements of the 3rd generation infrared focal plane arrays are described. Good uniformity is observed over 75mm HgCdTe epilayers,and th...Some results on the molecular-beam epitaxial growth of HgCdTe focusing on the requirements of the 3rd generation infrared focal plane arrays are described. Good uniformity is observed over 75mm HgCdTe epilayers,and the deviation in cutoff wavelength is within 0. 1μm at 80K. A variety of surface defects are observed and the formation mechanism is discussed. The average density of surface defects in 75mm HgCdTe epiluyers is found to be less than 300cm^-2. It is found that the surface sticking coefficient of As during HgCdTe growth is very low and is sensitive to growth temperature, being only -1 × 10^-4 at 170℃. The activation energy of As in HgCdTe was determined to be 19.5meV,which decreases as （Na - Nd）^1/3 with a slope of 3.1 × 10^-5 meV · cm. The diffusion coefficients of As in HgCdTe of 1.0 ± 0,9 × 10^-16,8 ± 3 × 10^- is, and 1.5 ± 0.9 × 10^-13 cm^2/s are obtained at temperatures of 240,380, and 440℃, respectively under Hg-saturated pressure. The MBE-grown HgCdTe is incorporated into FPA fabrications,and the preliminary results are presented.展开更多
文摘对原位 As_4掺杂 MBE HgCdTe 材料退火前后的电学性质进行了研究。原生样品以及 N 型退火样品的测试结果显示,随着 As 掺杂进入 HgCdTe 的同时,样品中产生了额外的 Hg 空位,并且在样品中引进了一种 N 型深能级结构。不同 Hg 分压下的激活退火结果显示,高温汞压下退火可以获得 P 型 MBE HgCdTe 材料。但是,真空退火结果显示 As 很难被激活。说明在激活退火过程中 As 在各个格点之间转移时,外界的 Hg 起重要作用。
文摘Some results on the molecular-beam epitaxial growth of HgCdTe focusing on the requirements of the 3rd generation infrared focal plane arrays are described. Good uniformity is observed over 75mm HgCdTe epilayers,and the deviation in cutoff wavelength is within 0. 1μm at 80K. A variety of surface defects are observed and the formation mechanism is discussed. The average density of surface defects in 75mm HgCdTe epiluyers is found to be less than 300cm^-2. It is found that the surface sticking coefficient of As during HgCdTe growth is very low and is sensitive to growth temperature, being only -1 × 10^-4 at 170℃. The activation energy of As in HgCdTe was determined to be 19.5meV,which decreases as （Na - Nd）^1/3 with a slope of 3.1 × 10^-5 meV · cm. The diffusion coefficients of As in HgCdTe of 1.0 ± 0,9 × 10^-16,8 ± 3 × 10^- is, and 1.5 ± 0.9 × 10^-13 cm^2/s are obtained at temperatures of 240,380, and 440℃, respectively under Hg-saturated pressure. The MBE-grown HgCdTe is incorporated into FPA fabrications,and the preliminary results are presented.
