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Mechanically Strong and Flame‑Retardant PBO/BN/MXene Nanocomposite Paper with Low Thermal Expansion Coefficient,for Efficient EMI Shielding and Heat Dissipation 被引量:2
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作者 Yong Liu Ning Zhao Jian Xu 《Advanced Fiber Materials》 SCIE EI CAS 2023年第5期1657-1670,共14页
As portable and wearable electronic devices are rapidly developing,there is an urgent need for flexible and robust thermally conductive electromagnetic interference shielding materials to address the associated electr... As portable and wearable electronic devices are rapidly developing,there is an urgent need for flexible and robust thermally conductive electromagnetic interference shielding materials to address the associated electromagnetic pollution and overheating issues.Herein,multifunctional poly(p-phenyl-2,6-phenylene bisoxazole)nanofiber/boron nitride nanosheet/Ti_(3)C_(2)T_(x)MXene nanosheet(PBO/BN/MXene)composite papers are prepared by a gel microparticle-mediated ordered assembly process with the aid of vacuum-assisted filtration.Nacre-like“brick and mortar”structure,segregated structure and sandwich structure are integrated into the composite paper,so that efficient thermally and electrically conductive networks have been established.When the BN and MXene contents are 29.2 wt%and 41.7 wt%,the 13μm thick composite paper exhibits an EMI shielding performance of 31.8 dB and a thermal conductivity of 26.1 W/mK,markedly superior to those of the control samples without the ordered structures.Meanwhile,because of the unique architecture and inherent advantages of the building blocks,the composite paper exhibits extremely low coefficient of thermal expansion(~1.43 ppm/K),excellent mechanical properties,and outstanding thermal stability and flame retardance,making it highly advantageous for practical applications in electronic devices.This work offers a promising approach for fabricating high-performance multifunctional composites by constructing efficient filler networks. 展开更多
关键词 Coefficient of thermal expansion EMI shielding NANOCOMPOSITE Ordered assembly thermal conductivity
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连续变焦红外热像仪结构设计及装调工艺研究
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作者 石彰 贺媛 潘栋 《激光与红外》 CAS CSCD 北大核心 2024年第3期404-410,共7页
本文研究了连续变焦红外热像仪的结构设计和装调工艺。在设计阶段进行了振动、冲击仿真分析。提出了连续变焦组件的光机装调工艺方法。搭建了小视场与安装基准偏轴度的测量方法。完成了该红外热像仪的光轴一致性检测和光轴稳定性验证试... 本文研究了连续变焦红外热像仪的结构设计和装调工艺。在设计阶段进行了振动、冲击仿真分析。提出了连续变焦组件的光机装调工艺方法。搭建了小视场与安装基准偏轴度的测量方法。完成了该红外热像仪的光轴一致性检测和光轴稳定性验证试验。检测和试验验证结果表明各项关键机械性能指标优良,证明该红外热像仪的整机系统结构设计满足工程化应用需求。 展开更多
关键词 红外热像仪 连续变焦 装调工艺
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QFN热沉焊盘空洞形成机理与解决措施 被引量:6
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作者 贾忠中 《电子工艺技术》 2017年第1期60-62,共3页
QFN热沉焊盘空洞控制是QFN焊接工艺难题之一,也是业界的难题之一。结合业界的一些研究成果,对QFN热沉焊盘空洞的形成机理进行定性分析,并提出了系统性的有效控制措施。
关键词 QFN 热沉焊盘 空洞 电子组装
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Design and assembly of a nested imaging X-ray telescope for the Hot Universe Baryon Surveyor mission
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作者 Jun Yu Ruohui Xian +8 位作者 Xiaoqiang Wang Yifan Wang Zhanshan Wang Wei Zhang Yibo Cai Jing Yang Xi Lu Wei Wang Wei Cui 《Astronomical Techniques and Instruments》 CSCD 2024年第3期157-165,共9页
The Hot Universe Baryon Surveyor (HUBS) mission will carry a nested X-ray telescope capable of observing an energy range from 0.5 keV to 2 keV to study hot baryon evolution. In this paper, we report the latest progres... The Hot Universe Baryon Surveyor (HUBS) mission will carry a nested X-ray telescope capable of observing an energy range from 0.5 keV to 2 keV to study hot baryon evolution. In this paper, we report the latest progress in the design and construction of nested X-ray telescopes which were designed to use a three-stage conic-approximation type assembly to simplify the manufacturing process. The mirror substrate is made using the thermal glass slumping method, with mirrors characterized by a root-mean-square roughness of 0.3 nm, with expected high reflectivity and good thermal stability. We also discuss methods of telescope construction and conduct a deformation analysis of the manufactured mirror. The in situ measurement system program is developed to guide the telescope assembly process. 展开更多
关键词 Nested X-ray telescope thermal glass slumping Telescope assembly In situ measurement
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装配式混凝土夹芯拱形屋盖性能分析
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作者 应仟壹 王弘起 +1 位作者 胡国壮 程麦理 《河南科技》 2024年第2期64-67,共4页
【目的】为切实降低建筑碳排放,满足“双碳”发展背景下建筑业的发展要求。【方法】通过对一种新型装配式混凝土夹芯拱形屋盖进行分析,探讨该结构的空间构形特点,研究空间曲面夹芯拱形板的力学性能、热工性能及装配施工技术。【结果】... 【目的】为切实降低建筑碳排放,满足“双碳”发展背景下建筑业的发展要求。【方法】通过对一种新型装配式混凝土夹芯拱形屋盖进行分析,探讨该结构的空间构形特点,研究空间曲面夹芯拱形板的力学性能、热工性能及装配施工技术。【结果】研究表明,装配式混凝土夹芯拱形屋盖力学性能好、承载能力高,夹芯保温层能够有效改善热工性能,屋盖单元的预制生产、装配施工方便。【结论】根据建筑结构设计分析方法,研究了混凝土夹芯拱形屋盖的关键装配施工技术,并提出了优化策略和建议。本研究可为我国寒冷采暖地区装配式建筑的发展提供借鉴。 展开更多
关键词 拱形屋盖 混凝土夹芯板 力学性能 热工性能 装配施工
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羧甲基壳聚糖对牛骨胶原蛋白微观结构、热稳定性及自组装性质的影响
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作者 刘泓 郭玉杰 +4 位作者 许雄 李侠 张鸿儒 张春晖 徐杨 《食品科学》 EI CAS CSCD 北大核心 2024年第14期1-13,共13页
构建具备良好热稳定性、自组装性质及生物相容性的可食性细胞外基质(extracellular matrix,ECM)类似物支架对于制造结构化细胞培养肉制品至关重要。将羧甲基壳聚糖(carboxymethyl chitosan,CMCS)引入牛骨胶原蛋白(bovine bone collagen,... 构建具备良好热稳定性、自组装性质及生物相容性的可食性细胞外基质(extracellular matrix,ECM)类似物支架对于制造结构化细胞培养肉制品至关重要。将羧甲基壳聚糖(carboxymethyl chitosan,CMCS)引入牛骨胶原蛋白(bovine bone collagen,BBC)体系中,通过光谱分析(紫外、红外、荧光光谱)发现BBC与CMCS的相互作用随着引入CMCS添加量的增加而增强,但并未影响BBC的三螺旋结构。差示扫描量热法/热重分析结果表明,CMCS的引入增强了BBC体系的热稳定性。浊度试验及扫描电子显微镜/透射电子显微镜观察结果证实了CMCS引入后胶原蛋白纤维形成度呈上升趋势,聚集行为更明显且自组装速率产生变化,呈现出更疏松扭曲的三维结构以及更大的纤维直径及更广泛的直径分布。但CMCS的引入并未明显影响BBC的D-周期性结构(胶原纤维自组装过程中形成的特征性明暗交替的周期性横纹结构)形成及其长度,且CMCS引入前后体系的细胞相容性也未呈现显著性差异。随着引入CMCS添加量增加,CMCS和BBC之间的静电作用力可能较共价相互作用和氢键更占优势。这些结果表明,CMCS的引入不影响BBC三螺旋结构完整性和生物相容性,并改善了BBC的热稳定性及体外自组装性质。这为开发新型优良可食性胶原蛋白基ECM仿生支架在细胞培养肉领域的应用以及畜禽骨副产物高值化精深加工利用提供了参考信息。 展开更多
关键词 细胞培养肉 细胞外基质 牛骨胶原蛋白 羧甲基壳聚糖 微观结构 热稳定性 自组装
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Controlled Fabrication of Uniform Digital Nanorods from Precise Sequence-Defined Amphiphilic Polymers in Aqueous Media 被引量:1
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作者 Qiang-Qiang Shi Xin Zhou +4 位作者 Jie Xu Ning Wang Jia-Lin Zhang Xiang-Long Hu Shi-Yong Liu 《Chinese Journal of Polymer Science》 SCIE EI CAS CSCD 2023年第5期768-777,I0010,共11页
Compared with spherical micelles,rod/worm-like micelles not only have extended blood circulation duration,but also exhibit favorable cellular uptake behavior,which is promising for next-generation nanomedicine and bio... Compared with spherical micelles,rod/worm-like micelles not only have extended blood circulation duration,but also exhibit favorable cellular uptake behavior,which is promising for next-generation nanomedicine and biomaterials.However,the controllable fabrication of narrowly dispersed nanorods in aqueous media is still challenging.Herein,the methodology of thermal annealing was developed for the fabrication of helical nanorods as well as a series of nanorods with different lengths.The thermal annealing process generally consisted of adding a percentage of organic solvent(10%(V/V)or 20%(V/V))to the digital micellar aqueous dispersion,followed by heating at 90℃for 1 h,then cooling naturally to room temperature,and dialyzing against water to remove the organic solvent.Right-handed helical nanorods were afforded by the treatment of 45 nm digital micelles in the presence of 10%(V/V)dioxane,while left-handed helical nanorods were obtained in the presence of 20%(V/V)dioxane.Meanwhile,the controlled growth of rod-like digital micelles was achieved after thermal annealing in the presence of different types of organic solvents,and the length of the annealed nanorods was correlated with the types of organic solvent.Furthermore,no matter the size of initial digital micelles,they all exhibited similar trend of rod growth in the presence of a certain amount of organic solvent,allowing for controllable formulation of narrowly dispersed nanorods.In addition,supramolecular self-assembly by amphiphilic dendritic oligourethane readily fabricated diverse uniform nanorods in aqueous media.Overall,this work provided an attractive methodology to fabricate uniform digital nanorods. 展开更多
关键词 Sequence-defined amphiphilic polymers Digital nanorods thermal annealing Dendritic oligourethane SELF-assembly
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Solvent-free Synthesis,Crystal Structure and Thermal Stability of Ionic Liquid 1-Hexadecyl-3-methylimidazolium Bromide 被引量:2
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作者 赵亚梅 胡小玲 +2 位作者 张秋禹 管萍 于进洋 《Chinese Journal of Structural Chemistry》 SCIE CAS CSCD 2009年第9期1077-1082,共6页
Ionic liquid 1-hexadecyl-3-methylimidazolium bromide [C16mim]Br was synthesized by solvent-free alkylation of N-methylimidzole with hexadecyl bromide. A large transparent single crystal of 1-hexadecyl-3-methylimidazol... Ionic liquid 1-hexadecyl-3-methylimidazolium bromide [C16mim]Br was synthesized by solvent-free alkylation of N-methylimidzole with hexadecyl bromide. A large transparent single crystal of 1-hexadecyl-3-methylimidazolium bromide monohydrate ([C16mim]Br·H2O), 4 mm in length, was firstly obtained in the water-trichloromethane-toluene growth system (Vwater'Vtrichloromethane'Vtoluene = 0.1:1:2). The crystal structure was determined by single-crystal X-ray diffraction method. It crystallizes in the triclinic system, space group P1, with a = 5.4962(15), b = 7.839(2), c = 27.279(8) A, α = 94.375, β = 91.500, γ = 101.999°, Z = 2, V = 1145.2(5) A3, C20H41BrN2O, Mr = 405.46, Dc = 1.176 Mg/m3, μ = 1.804 mm^-1, F(000) = 436, the final R = 0.0523 and wR = 0.1345. The 3D supramolecular structure is constructed through weak interactions between imidazolium cations, Br- anions and lattice water molecules. The long alkyl chain to the imidazolium ring and lattice water molecules play an important role in the self-assembly process. Moreover, it is proposed that [C16mim]Br in water has aggregation behavior and the possible self-assembled structure is the interdigitated pattern. Finally, thermal stability of [C16mim][Br]·H2O was also studied by DSC and TGA analysis. 展开更多
关键词 ionic liquid crystal structure SELF-assembly thermal stability
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Graphene film for thermal management:A review 被引量:3
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作者 Pei Huang Yao Li +5 位作者 Gang Yang Zheng-Xin Li Yuan-Qing Li Ning Hu Shao-Yun Fu Kostya SNovoselov 《Nano Materials Science》 CAS CSCD 2021年第1期1-16,共16页
Thermal conductivity and thermal dissipation are of great importance for modern electronics due to the increased transistor density and operation frequency of contemporary integrated circuits.Due to its exceptionally ... Thermal conductivity and thermal dissipation are of great importance for modern electronics due to the increased transistor density and operation frequency of contemporary integrated circuits.Due to its exceptionally high thermal conductivity,graphene has drawn considerable interests worldwide for heat spreading and dissipation.However,maintaining high thermal conductivity in graphene laminates(the basic technological unit)is a significant technological challenge.Aiming at highly thermal conductive graphene films(GFs),this prospective review outlines the most recent progress in the production of GFs originated from graphene oxide due to its great convenience in film processing.Additionally,we also consider such issues as film assembly,defect repair and mechanical compression during the post-treatment.We also discuss the thermal conductivity in in-plane and through-plane direction and mechanical properties of GFs.Further,the current typical applications of GFs are presented in thermal management.Finally,perspectives are given for future work on GFs for thermal management. 展开更多
关键词 Graphene film thermal conductivity Film assembly Defect repair FREE-STANDING
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基于飞机装配的热变形误差分析方法 被引量:3
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作者 张俐 王炜辰 《机械工程与自动化》 2017年第1期4-6,共3页
通过分析飞机装配过程中受环境温度影响的相关因素,总结出一整套有关装配、对接工艺中关键测量点的综合热变形误差分析方法。采用从零件到整体、从无约束条件到有工装约束条件的思路得出关键测量点在各个方向的最终位置偏移量,并以蒙皮... 通过分析飞机装配过程中受环境温度影响的相关因素,总结出一整套有关装配、对接工艺中关键测量点的综合热变形误差分析方法。采用从零件到整体、从无约束条件到有工装约束条件的思路得出关键测量点在各个方向的最终位置偏移量,并以蒙皮装配过程与客机机身对接过程为例,验证上述方法的有效性。 展开更多
关键词 热变形 误差分析 飞机装配
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CBGA焊球热疲劳及寿命仿真分析 被引量:3
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作者 李九峰 《电子工艺技术》 2020年第4期218-221,共4页
由于BGA封装芯片的I/O引脚数目多、所占空间小,得到了广泛应用。在长期服役过程中BGA芯片受到复杂的热、电、力作用使焊球产生疲劳失效,特别是在航空航天等高可靠性产品领域。通过温度加速度试验模拟了产品的工作年限,找到了有效的工艺... 由于BGA封装芯片的I/O引脚数目多、所占空间小,得到了广泛应用。在长期服役过程中BGA芯片受到复杂的热、电、力作用使焊球产生疲劳失效,特别是在航空航天等高可靠性产品领域。通过温度加速度试验模拟了产品的工作年限,找到了有效的工艺改进方法。 展开更多
关键词 CBGA 热疲劳 组装工艺 置换锡球
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Enhanced thermal conductivity and dielectric properties in electrostatic self-assembly 3D pBN@nCNTs fillers loaded in epoxy resin composites 被引量:3
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作者 Dong-Li Zhang Sheng-Nan Liu +4 位作者 Hui-Wu Cai Qi-Kun Feng Shao-Long Zhong Jun-Wei Zha Zhi-Min Dang 《Journal of Materiomics》 SCIE EI 2020年第4期751-759,共9页
High-performance epoxy(EP)composites with excellent thermal conductivity and dielectric properties have attracted increasing attention for effective thermal management.In this work,three-dimensional(3D)structural func... High-performance epoxy(EP)composites with excellent thermal conductivity and dielectric properties have attracted increasing attention for effective thermal management.In this work,three-dimensional(3D)structural functional fillers were prepared by an electrostatic self-assembly approach.The negatively charged carbon nanotubes(nCNTs)prepared by carboxylation on the surface of CNTs were attached to the positively charged boron nitride(pBN)to form the 3D pBN@nCNTs functional fillers.The morphological characterizations of the formed 3D pBN@nCNTs fillers and epoxy composites were established,illustrating that nCNTs were linearly overlapped between the BN sheets,thus forming a 3D heat conduction network in the epoxy matrix.The synergistic effect of pBN with nCNTs on the enhancement of thermal conductivity and dielectric properties of composites was systematically studied.The experimental results demonstrated that the thermal conductivity of pBN@nCNTs/EP composites could reach 1.986 W m1K1 with the loading of 50 wt%fillers at 10:1 mass ratio of pBN:nCNTs,which is 464%and 124%higher than that of pure EP and BN/EP,respectively.Simultaneously,the dielectric permittivity was successfully increased to 15.14.Moreover,the thermal stability of the composites was synchronously enhanced.This study provides a facile path to fabricate thermosetting polymer composites with high thermal conductivity and dielectric properties. 展开更多
关键词 thermal conductivity Dielectric permittivity COMPOSITES Electrostatic self-assembly
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基于Pro/E香皂冷打印机构的虚拟设计与运动分析 被引量:2
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作者 龚晓燕 居志兰 陈厚军 《机械设计与制造》 北大核心 2011年第8期37-39,共3页
在产品的开发竞争日益激烈的今天,为缩短产品的研发周期,利用软件对产品进行虚拟设计已经成为一种趋势。在所有设计环节中,机构的运动仿真是产品开发设计过程中的重要环节,基于Pro/E软件的高级功能,实现了香皂冷打印零部件的三维造型设... 在产品的开发竞争日益激烈的今天,为缩短产品的研发周期,利用软件对产品进行虚拟设计已经成为一种趋势。在所有设计环节中,机构的运动仿真是产品开发设计过程中的重要环节,基于Pro/E软件的高级功能,实现了香皂冷打印零部件的三维造型设计及冷打印机构虚拟设计及运动仿真。对冷打印机构的虚拟装配,干涉检查和运动仿真分析表明:运动模拟与实际机构运动相吻合,能够达到机构的运动要求,为机构优化设计提供了一种简明有效的思路。 展开更多
关键词 共轭凸轮 冷打印 运动仿真 虚拟装配
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氧化锌微米棒的微观生长过程 被引量:2
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作者 王维维 朱丽萍 +4 位作者 叶志镇 王敬蕊 杨叶锋 何海平 赵炳辉 《材料科学与工程学报》 CAS CSCD 北大核心 2009年第3期348-351,共4页
利用物理热蒸发方法在光滑的(111)硅衬底上生长氧化锌微米棒,生长温度为700℃。在硅衬底的不同区域由于生长环境不同,生成物的形貌也不相同。利用扫描电镜图可以很直观地推测出一个完整的氧化锌微米棒生长过程。透射电镜图片显示了纳米... 利用物理热蒸发方法在光滑的(111)硅衬底上生长氧化锌微米棒,生长温度为700℃。在硅衬底的不同区域由于生长环境不同,生成物的形貌也不相同。利用扫描电镜图可以很直观地推测出一个完整的氧化锌微米棒生长过程。透射电镜图片显示了纳米棒与微米棒之间完美的外延关系。 展开更多
关键词 晶体外貌 外延生长 物理热蒸发 自组装
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基于图像分析的热电池缺陷无损检测方法 被引量:2
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作者 张思祥 王哲 +3 位作者 张鹏 王智 赵子豪 周围 《传感器与微系统》 CSCD 北大核心 2021年第6期129-132,共4页
针对目前国内外热电池装配缺陷检测多靠人工分辨的问题,提出了一种基于图像分析检测热电池装配缺陷的方法。通过对热电池的标准单体电池和缺陷单体电池进行分析,以热电池内部结构特征自对比实现对热电池内单体电池的整体倒装、单体电池... 针对目前国内外热电池装配缺陷检测多靠人工分辨的问题,提出了一种基于图像分析检测热电池装配缺陷的方法。通过对热电池的标准单体电池和缺陷单体电池进行分析,以热电池内部结构特征自对比实现对热电池内单体电池的整体倒装、单体电池漏装集流片、装配次序错误进行检测,建立了一个无损检测系统。利用模板匹配将X射线仪拍摄的电池图片中的电池堆部分进行分割,对电池堆不同位置进行竖向扫描产生灰度与位置的波形图,通过自身的对比以及多位置的结构特征参数进行缺陷判断。最终对无损电池检测正确率为94%,缺陷电池检出准确率为96%。 展开更多
关键词 热电池 无损检测 装配缺陷 图像分析
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Effect of substrate type on Ni self-assembly process
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作者 Xuzhao Chai Boyang Qu +7 位作者 Yuechao Jiao Ping Liu Yanxia Ma Fengge Wang Xiaoquan Li Xiangqian Fang Ping Han Rong Zhang 《Chinese Physics B》 SCIE EI CAS CSCD 2019年第1期478-483,共6页
Ni self-assembly has been performed on Ga N(0001), Si(111) and sapphire(0001) substrates. Scanning electron microscopy(SEM) images verify that the Si(111) substrate leads to failure of the Ni assembly due to Si–N int... Ni self-assembly has been performed on Ga N(0001), Si(111) and sapphire(0001) substrates. Scanning electron microscopy(SEM) images verify that the Si(111) substrate leads to failure of the Ni assembly due to Si–N interlayer formation; the GaN(0001) and sapphire(0001) substrates promote assembly of the Ni particles. This indicates that the GaN/sapphire(0001) substrates are fit for Ni self-assembly. For the Ni assembly process on Ga N/sapphire(0001) substrates,three differences are observed from the x-ray diffraction(XRD) patterns:(i) Ni self-assembly on the sapphire(0001) needs a 900?C annealing temperature, lower than that on the GaN(0001) at 1000?C, and loses the Ni network structure stage;(ii) the Ni particle shape is spherical for the sapphire(0001) substrate, and truncated-cone for the GaN(0001) substrate; and(iii) a Ni–N interlayer forms between the Ni particles and the GaN(0001) substrate, but an interlayer does not appear for the sapphire(0001) substrate. All these differences are attributed to the interaction between the Ni and the Ga N/sapphire(0001) substrates. A model is introduced to explain this mechanism. 展开更多
关键词 SELF-assembly thermal ANNEALING SUBSTRATES
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Microstructural Evolution and Cracking of Pb-free Ball Grid Array Assemblies under Thermal Cycling
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作者 Wei WANG Zhongguang WANG +1 位作者 Aiping XIAN Jianku SHANG 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2007年第1期85-91,共7页
Two kinds of CBGA (ceramic ball grid array) assemblies were made by reflow soldering process using two different Pb-free solders. Microstructural evolution and cracks induced by thermal cycling in CBGA assemblies we... Two kinds of CBGA (ceramic ball grid array) assemblies were made by reflow soldering process using two different Pb-free solders. Microstructural evolution and cracks induced by thermal cycling in CBGA assemblies were examined by scanning electron microscopy (SEM) and finite element method (FEM). Before thermal cycling, intermetallic compounds (IMCs) Cu6Sn5 and Ag3Sn were observed at the solder interface between Cu and Ag metallizations, respectively. After thermal cycling, another IMC Cu3Sn was observed near the Cu pad in both two assemblies and the layers of Cu6Sn5 and Ag3Sn became thicker. As a result of thermal cycling, cyclic stress and strain were accumulated in the solder joint leading to fatigue cracking. Both experiments and FEM revealed that cracks preferred to initiate at the corner of each solder joint. Multi-modes of the crack propagation were found in the two assemblies. Based on Coffin-Manson equation, the thermal fatigue life was calculated and the predicted life showed good agreement with the experimental results. 展开更多
关键词 CBGA thermal cycling FEM assembly CRACKING
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基于ANSYS的GK320型密炼机转子的热装配模拟研究
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作者 汪传生 张守锋 +2 位作者 王孔烁 王志飞 边慧光 《橡胶工业》 CAS 2021年第7期528-533,共6页
密炼机转子(转子体与转子芯轴组成)采用热装配方法实现过盈配合,装配期间转子体热变形和热应力易引起转子体与转子芯轴间产生缝隙,从而导致转子漏水。针对GK320型密炼机转子热装配过程建立转子模型,采用ANSYS有限元软件对不同过盈量下... 密炼机转子(转子体与转子芯轴组成)采用热装配方法实现过盈配合,装配期间转子体热变形和热应力易引起转子体与转子芯轴间产生缝隙,从而导致转子漏水。针对GK320型密炼机转子热装配过程建立转子模型,采用ANSYS有限元软件对不同过盈量下的转子进行温度场分析,并将温度场作为条件进行转子体热变形和热应力分析,得到过盈量与转子体热变形和热应力之间的关系。本研究结果可为密炼机转子的设计、加工和装配提供参考。 展开更多
关键词 密炼机 转子 热装配 过盈配合 热变形 热应力 有限元分析
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利用热胀冷缩原理拆除炼钢转炉主动耳轴的方法 被引量:1
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作者 刘凤鹤 俞兵 靳军 《机械研究与应用》 2019年第3期176-177,180,共3页
在组装炼钢转炉主动耳轴和耳轴块的过程中,由于组装方法不当导致主动耳轴装配不到位。为取出装配不到位的主动耳轴,通过对炼钢转炉主动耳轴装配结构的分析,得出利用主动耳轴块热胀与主动耳轴冷缩相结合的原理,在耳轴块内孔膨胀、主动耳... 在组装炼钢转炉主动耳轴和耳轴块的过程中,由于组装方法不当导致主动耳轴装配不到位。为取出装配不到位的主动耳轴,通过对炼钢转炉主动耳轴装配结构的分析,得出利用主动耳轴块热胀与主动耳轴冷缩相结合的原理,在耳轴块内孔膨胀、主动耳轴冷缩的情况下,利用主动耳轴自重力的作用,拆除了装配不到位的主动耳轴,解决了主动耳轴装配不到位拆除主动耳轴的难题。此方法的成功应用,为产品的过盈装配和过盈拆除拓宽了思路和方法。 展开更多
关键词 热胀 冷缩 自重力 过盈装配 过盈拆除
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刚柔嵌段共聚物在水溶液中的温度响应自组装 被引量:1
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作者 冯永嘉 温智廷 +1 位作者 陈铁 金龙一 《延边大学学报(自然科学版)》 CAS 2015年第3期219-224,共6页
环氧乙烷链具有低临界溶解温度(LCST)效应,其在水溶液中会随着温度变化在水合作用-脱水作用之间进行可逆的转化,从而引发分子构象的变化,并最终改变分子聚集体的形貌和性质.本文将介绍基于聚环氧乙烷链为柔性链段的刚柔嵌段小分子在水... 环氧乙烷链具有低临界溶解温度(LCST)效应,其在水溶液中会随着温度变化在水合作用-脱水作用之间进行可逆的转化,从而引发分子构象的变化,并最终改变分子聚集体的形貌和性质.本文将介绍基于聚环氧乙烷链为柔性链段的刚柔嵌段小分子在水溶液中形成的多种热响应纳米结构以及它们的自组装行为原理,为热响应纳米材料的制备和研究提供参考. 展开更多
关键词 嵌段共聚物 热响应 自组装
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