系统级封装(System in Package,SiP)已经成为重要的先进封装和系统集成技术,是未来电子产品小型化和多功能化的重要技术路线,在微电子和电子制造领域具有广阔的应用市场和发展前景,发展也极为迅速。对目前SiP技术的研究现状和发展趋势...系统级封装(System in Package,SiP)已经成为重要的先进封装和系统集成技术,是未来电子产品小型化和多功能化的重要技术路线,在微电子和电子制造领域具有广阔的应用市场和发展前景,发展也极为迅速。对目前SiP技术的研究现状和发展趋势进行了综述,重点关注了国际上半导体产业和重要的研究机构在SiP技术领域的研究和开发,对我国SiP技术的发展做了简单的回顾和展望。展开更多
设计了一款采用硅基板作为载体的毫米波上变频微系统系统级封装(System in Package,SiP)模块。该模块利用类同轴硅通孔(Through-Silicon-Via,TSV)结构解决了毫米波频段信号在转接板层间低损耗垂直传输的问题。该结构整体采用四层硅基板...设计了一款采用硅基板作为载体的毫米波上变频微系统系统级封装(System in Package,SiP)模块。该模块利用类同轴硅通孔(Through-Silicon-Via,TSV)结构解决了毫米波频段信号在转接板层间低损耗垂直传输的问题。该结构整体采用四层硅基板封装,并在封装完成后对硅基射频SiP模块进行了测试。测试结果显示,在工作频段29~31 GHz之间,其增益大于27 dB,端口驻波小于1.4,且带外杂散抑制大于55 dB。该毫米波硅基SiP模块具有结构简单、集成度高、射频性能良好等优点,其体积不到传统二维集成结构的5%,实现了毫米波频段模块的微系统化,可广泛运用于射频微系统。展开更多
近年来,微电子技术进入到纳电子/集成微系统时代,SIP(System in Package)和SOC(System on Chip)是微系统实现的两种重要技术途径;基于神经网络的深度学习技术在图形图像、计算机视觉和目标识别等方面得以广泛应用。卷积神经网络的深度...近年来,微电子技术进入到纳电子/集成微系统时代,SIP(System in Package)和SOC(System on Chip)是微系统实现的两种重要技术途径;基于神经网络的深度学习技术在图形图像、计算机视觉和目标识别等方面得以广泛应用。卷积神经网络的深度学习技术在嵌入式平台的小型化、微型化是一项重要研究领域。如何将神经网络轻量化和微系统相结合,达到性能、体积和功耗的最优化平衡是一难点。介绍了一款将SIP技术和基于FPGA的卷积神经网络相结合的微系统实现方案,它以Zynq SOC和FLASH、DDR3存储器为主要组成,利用SIP高密度系统封装技术进行集成,在其中的PL端(FPGA)采用HLS来设计CNN(Convolutional Neural Network,卷积神经网络)中的卷积层和池化层,生成IP核,分时复用构建微系统,设计实现了Micro_VGGNet轻量化模型。测试采用MNIST手写数字数据集作为训练和测试样本,该微系统能够实准确识别手写数字,准确率达到98.1%。体积仅为30 mm×30 mm×1.2 mm,在100 MHz工作频率下,图像处理速度可达到20.65 FPS,功耗仅为2.1 W,实现了轻量化神经网络微系统的多目标平衡(性能、体积和功耗)。展开更多
The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical ...The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical quantities,ICs typically provide functionalities related to the signals of these transducers,such as analog-to-digital conversion,amplification,filtering and information processing as well as communication between the MEMS transducer and the outside world.Thus,the vast majority of commercial MEMS products,such as accelerometers,gyroscopes and micro-mirror arrays,are integrated and packaged together with ICs.There are a variety of possible methods of integrating and packaging MEMS and IC components,and the technology of choice strongly depends on the device,the field of application and the commercial requirements.In this review paper,traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed.These include approaches based on the hybrid integration of multiple chips(multi-chip solutions)as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques.These are important technological building blocks for the‘More-Than-Moore’paradigm described in the International Technology Roadmap for Semiconductors.In this paper,the various approaches are categorized in a coherent manner,their merits are discussed,and suitable application areas and implementations are critically investigated.The implications of the different MEMS and IC integration approaches for packaging,testing and final system costs are reviewed.展开更多
随着军用无人机等航电系统不断朝着小型化、智能化、综合化的方向发展,如何有效满足装备的低SWaP(Size,Weight and Power)要求成为一大难题。介绍了某型宽带综合化数字预处理模块的研制,利用“裸芯片+高密度基板”系统级封装(SiP)的方...随着军用无人机等航电系统不断朝着小型化、智能化、综合化的方向发展,如何有效满足装备的低SWaP(Size,Weight and Power)要求成为一大难题。介绍了某型宽带综合化数字预处理模块的研制,利用“裸芯片+高密度基板”系统级封装(SiP)的方式对信号处理平台(DSP、FPGA、SerDes和DDR芯片)进行集成,替代目前业界普遍采用的“封装芯片+印制板+平面集成”的传统方式,实现宽带综合化数字信号处理模块的高密度集成。在主要性能指标(可编程逻辑资源、定点处理能力、浮点处理能力、数据传输速率)不变的情况下,使得信号处理模块的面积降低为45 mm×45 mm,重量降低到103 g。展开更多
文摘系统级封装(System in Package,SiP)已经成为重要的先进封装和系统集成技术,是未来电子产品小型化和多功能化的重要技术路线,在微电子和电子制造领域具有广阔的应用市场和发展前景,发展也极为迅速。对目前SiP技术的研究现状和发展趋势进行了综述,重点关注了国际上半导体产业和重要的研究机构在SiP技术领域的研究和开发,对我国SiP技术的发展做了简单的回顾和展望。
基金The work was partially funded by the Swedish Research Council,by the European 7^(th)Framework Programme under grant agreement FP7-NEMIAC(No.288670)by the European Research Council through the ERC Advanced Grant xMEMs(No.267528)and the ERC Starting Grant M&M’s(No.277879).
文摘The majority of microelectromechanical system(MEMS)devices must be combined with integrated circuits(ICs)for operation in larger electronic systems.While MEMS transducers sense or control physical,optical or chemical quantities,ICs typically provide functionalities related to the signals of these transducers,such as analog-to-digital conversion,amplification,filtering and information processing as well as communication between the MEMS transducer and the outside world.Thus,the vast majority of commercial MEMS products,such as accelerometers,gyroscopes and micro-mirror arrays,are integrated and packaged together with ICs.There are a variety of possible methods of integrating and packaging MEMS and IC components,and the technology of choice strongly depends on the device,the field of application and the commercial requirements.In this review paper,traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed.These include approaches based on the hybrid integration of multiple chips(multi-chip solutions)as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques.These are important technological building blocks for the‘More-Than-Moore’paradigm described in the International Technology Roadmap for Semiconductors.In this paper,the various approaches are categorized in a coherent manner,their merits are discussed,and suitable application areas and implementations are critically investigated.The implications of the different MEMS and IC integration approaches for packaging,testing and final system costs are reviewed.
