This manuscript is about a theoretical modelling of conversion efficiency improvement of a typical polycrystalline Si solar cell in 1D assumptions. The improvement is brought by the increase of the collection of the m...This manuscript is about a theoretical modelling of conversion efficiency improvement of a typical polycrystalline Si solar cell in 1D assumptions. The improvement is brought by the increase of the collection of the minority carriers charge in excess. This increase is the consequence of the influence of an electric field provided by the use of the open circuit photovoltage of another silicon solar cell. We assume that it is integrated two silicon solar cells to the system. The first solar cell provides the open circuit photovoltage which is connected to two aluminum planar armatures creating a planar capacitor. The second solar cell is placed under the uniform electric field created between the two aluminum armatures. This work has shown an improvement of the output electric power leading to the increase of the conversion efficiency. We observe an increase of 0.7% of the conversion efficiency of the second silicon solar cell.展开更多
The surface oxidation of silicon （Si） wafers by atomic oxygen radical anions （O- anions） and the preparation of metal-oxide-semiconductor （MOS） capacitors on the O-oxidized Si substrates have been examined for t...The surface oxidation of silicon （Si） wafers by atomic oxygen radical anions （O- anions） and the preparation of metal-oxide-semiconductor （MOS） capacitors on the O-oxidized Si substrates have been examined for the first time. The O- anions are generated from a recently developed O- storage-emission material of [Ca24Al2sO64]^4＋·4O^- （Cl2A7-O^- for short）. After it has been irradiated by an O- anion bean： （0.5 μA/cm^2） at 300℃ for 1-10 hours, the Si wafer achieves an oxide layer with a thickness ranging from 8 to 32 nm. X-ray photoelectron spectroscopy （XPS） results reveal that the oxide layer is of a mixture of SiO2, Si2 O3, and Si2O distributed in different oxidation depths. The features of the MOS capacitor of 〈Al electrode/SiOx/Si〉 are investigated by measuring capacitance-voltage （C - V） and current-voltage （I - V） curves. The oxide charge density is about 6.0 × 10^1 cm^-2 derived from the （C - V curves. The leakage current density is in the order of 10^-6 A/cm^2 below 4 MV/cm, obtained from the I - V curves. The O- anions formed by present method would have potential applications to the oxidation and the surface-modification of materials together with the preparation of semiconductor devices.展开更多
In silicon photonics, the carrier depletion scheme has been the most commonly used mechanism for demonstrat- ing high-speed electro-optic modulation. However, in terms of phase modulation efficiency, carrier- accumnla...In silicon photonics, the carrier depletion scheme has been the most commonly used mechanism for demonstrat- ing high-speed electro-optic modulation. However, in terms of phase modulation efficiency, carrier- accumnlation-based devices potentially offer almost an order of carrier depletion. Previously reported accumulation modulator magnitude improvement over those based on designs only considered vertical metal-oxide- semiconductor （MOS） capacitors, which imposes serious restrictions on the design flexibility and integratability with other photonic components. In this work, for the first time to our knowledge, we report experimental demonstration of an all-silicon accumulation phase modulator based on a lateral MOS capacitor. Using a Mach-Zehnder interferometer modulator with a 500-μm-long phase shifter, we demonstrate high-speed modulation up to 25 Gbit/s with a modulation efficiency （V πLπ） of 1.53 V·cm.展开更多
MOS capacitors with hafnium oxynitride（HfON）gate dielectrics were fabricated on Ge and Si substrates using the RF reactive magnetron sputtering method.A large amount of fixed charges and interface traps exist at the...MOS capacitors with hafnium oxynitride（HfON）gate dielectrics were fabricated on Ge and Si substrates using the RF reactive magnetron sputtering method.A large amount of fixed charges and interface traps exist at the Ge/HfON interface.HRTEM and XPS analyses show that Ge oxides were grown and diffused into HfON after post metal annealing.A Si nitride interfacial layer was inserted between Ge and HfON as diffusion barrier.Using this method,well behaved capacitance–voltage and current–voltage characteristics were obtained.Finally hystereses are compared under different process conditions and possible causes are discussed.展开更多
A 4H-silicon carbide metal-insulator-semiconductor structure with ultra-thin Al2O3 as the gate dielectric, deposited by atomic layer deposition on tile epitaxial layer of a 4H-SiC （0001） 80N-/N＋ substrate, has been...A 4H-silicon carbide metal-insulator-semiconductor structure with ultra-thin Al2O3 as the gate dielectric, deposited by atomic layer deposition on tile epitaxial layer of a 4H-SiC （0001） 80N-/N＋ substrate, has been fabricated. The experimental results indicate that the prepared ultra-thin Al2O3 gate dielectric exhibits good physical and electrical characteristics, including a high breakdown electrical field of 25 MV/cm, excellent interface properties （1 × 10^14 cm^-2） and low gate-leakage current （IG = 1 × 10^-3 A/cm 2@Eox = 8 MV/cm）. Analysis of the current conduction mecha- nism on the deposited Al2O3 gate dielectric was also systematically performed. The confirmed conduction mechanisms consisted of Fowler-Nordheim （FN） tuaneling, the Frenkel-Poole mechanism, direct tunneling and Schottky emission, and the dominant current conduction mechanism depends on the applied electrical field. When the gate leakage current mechanism is dominated by FN tunneling, the barrier height of SiC/Al2O3 is 1.4 eV, which can meet the requirements of silicon carbide metal-insulator-semiconductor transistor devices.展开更多
文摘This manuscript is about a theoretical modelling of conversion efficiency improvement of a typical polycrystalline Si solar cell in 1D assumptions. The improvement is brought by the increase of the collection of the minority carriers charge in excess. This increase is the consequence of the influence of an electric field provided by the use of the open circuit photovoltage of another silicon solar cell. We assume that it is integrated two silicon solar cells to the system. The first solar cell provides the open circuit photovoltage which is connected to two aluminum planar armatures creating a planar capacitor. The second solar cell is placed under the uniform electric field created between the two aluminum armatures. This work has shown an improvement of the output electric power leading to the increase of the conversion efficiency. We observe an increase of 0.7% of the conversion efficiency of the second silicon solar cell.
基金Project supported by the National Natural Science Foundation of China (Grant No 50772107)the National High Technology Development Program of China (Grant No 2006AA05Z118)
文摘The surface oxidation of silicon （Si） wafers by atomic oxygen radical anions （O- anions） and the preparation of metal-oxide-semiconductor （MOS） capacitors on the O-oxidized Si substrates have been examined for the first time. The O- anions are generated from a recently developed O- storage-emission material of [Ca24Al2sO64]^4＋·4O^- （Cl2A7-O^- for short）. After it has been irradiated by an O- anion bean： （0.5 μA/cm^2） at 300℃ for 1-10 hours, the Si wafer achieves an oxide layer with a thickness ranging from 8 to 32 nm. X-ray photoelectron spectroscopy （XPS） results reveal that the oxide layer is of a mixture of SiO2, Si2 O3, and Si2O distributed in different oxidation depths. The features of the MOS capacitor of 〈Al electrode/SiOx/Si〉 are investigated by measuring capacitance-voltage （C - V） and current-voltage （I - V） curves. The oxide charge density is about 6.0 × 10^1 cm^-2 derived from the （C - V curves. The leakage current density is in the order of 10^-6 A/cm^2 below 4 MV/cm, obtained from the I - V curves. The O- anions formed by present method would have potential applications to the oxidation and the surface-modification of materials together with the preparation of semiconductor devices.
基金Engineering and Physical Sciences Research Council(EPSRC)(EP/M008975/1,EP/M009416/1,EP/N013247/1,EP/R003076/1)EU Seventh Framework Programme(FP7)Marie-Curie Carrier-Integration-Grant(PCIG13-GA-2013-618116)
文摘In silicon photonics, the carrier depletion scheme has been the most commonly used mechanism for demonstrat- ing high-speed electro-optic modulation. However, in terms of phase modulation efficiency, carrier- accumnlation-based devices potentially offer almost an order of carrier depletion. Previously reported accumulation modulator magnitude improvement over those based on designs only considered vertical metal-oxide- semiconductor （MOS） capacitors, which imposes serious restrictions on the design flexibility and integratability with other photonic components. In this work, for the first time to our knowledge, we report experimental demonstration of an all-silicon accumulation phase modulator based on a lateral MOS capacitor. Using a Mach-Zehnder interferometer modulator with a 500-μm-long phase shifter, we demonstrate high-speed modulation up to 25 Gbit/s with a modulation efficiency （V πLπ） of 1.53 V·cm.
基金supported by the State Key Development Program for Basic Research of China(No.2006CB302704)
文摘MOS capacitors with hafnium oxynitride（HfON）gate dielectrics were fabricated on Ge and Si substrates using the RF reactive magnetron sputtering method.A large amount of fixed charges and interface traps exist at the Ge/HfON interface.HRTEM and XPS analyses show that Ge oxides were grown and diffused into HfON after post metal annealing.A Si nitride interfacial layer was inserted between Ge and HfON as diffusion barrier.Using this method,well behaved capacitance–voltage and current–voltage characteristics were obtained.Finally hystereses are compared under different process conditions and possible causes are discussed.
基金supported by the 2010 School Fundamental Scientific Research Fund of Xidian University (Grant No. K50510250008)
文摘A 4H-silicon carbide metal-insulator-semiconductor structure with ultra-thin Al2O3 as the gate dielectric, deposited by atomic layer deposition on tile epitaxial layer of a 4H-SiC （0001） 80N-/N＋ substrate, has been fabricated. The experimental results indicate that the prepared ultra-thin Al2O3 gate dielectric exhibits good physical and electrical characteristics, including a high breakdown electrical field of 25 MV/cm, excellent interface properties （1 × 10^14 cm^-2） and low gate-leakage current （IG = 1 × 10^-3 A/cm 2@Eox = 8 MV/cm）. Analysis of the current conduction mecha- nism on the deposited Al2O3 gate dielectric was also systematically performed. The confirmed conduction mechanisms consisted of Fowler-Nordheim （FN） tuaneling, the Frenkel-Poole mechanism, direct tunneling and Schottky emission, and the dominant current conduction mechanism depends on the applied electrical field. When the gate leakage current mechanism is dominated by FN tunneling, the barrier height of SiC/Al2O3 is 1.4 eV, which can meet the requirements of silicon carbide metal-insulator-semiconductor transistor devices.
