有序碳和无序碳都普遍被用作硅(Si)的复合材料。但是具有不同结晶度和孔结构的碳对硅基负极电化学性能的影响仍存在争议。本工作在严格控制碳含量和表面官能团的基础上,选择沥青(Pitch)和酚醛树脂(PR)作为有序碳和无序碳的前驱体,制备...有序碳和无序碳都普遍被用作硅(Si)的复合材料。但是具有不同结晶度和孔结构的碳对硅基负极电化学性能的影响仍存在争议。本工作在严格控制碳含量和表面官能团的基础上,选择沥青(Pitch)和酚醛树脂(PR)作为有序碳和无序碳的前驱体,制备了硅碳复合材料(Si@C)并系统地研究了其电化学行为。有序的晶体结构有利于复合物中的电子传输,中孔和大孔有利于锂离子的扩散。具有有序结构和小孔容的碳质涂层为Si的膨胀提供了很好的缓冲,电极在50次循环后仍保持结构完整性。然而,无序和多孔的结构降低了结构的稳定性并产生了很大的极化,这使得循环过程中体积不断膨胀,导致电化学性能较差。Si@C-Pitch在5 A g^(−1)下的容量是Si@C-PR的8倍,在0.5 A g^(−1)下100次循环后的容量保持率是Si@C-PR的1.9倍。该研究可为Si@C负极中炭材料的选择提供了理论指导。展开更多
To fabricate electronic packaging shell of coppermatrix composite with characteristics of high ther mal conductivity and low thermal expansion coefficient, semisolid forming technology, and powder metallurgy was combi...To fabricate electronic packaging shell of coppermatrix composite with characteristics of high ther mal conductivity and low thermal expansion coefficient, semisolid forming technology, and powder metallurgy was combined. Conventional mechanical mixing of Cu and SiC could have insufficient wettability, and a new method of semisolid processing was introduced for billets preparation. The SiC/Cu composites were first prepared by PM, and then, semisolid reheating was performed for the successive semisolid forging. Composite billets with SiC 35 % vol ume fraction were compacted and sintered pressurelessly, microstructure analysis showed that the composites pre pared by PM had high density, and the combination between SiC particles and Cualloy was good. Semisolid reheating was the crucial factor in determining the micro structure and thixotropic property of the billet. An opti mised reheating strategy was proposed： temperature 1,025 ℃and holding time 5 min.展开更多
文摘有序碳和无序碳都普遍被用作硅(Si)的复合材料。但是具有不同结晶度和孔结构的碳对硅基负极电化学性能的影响仍存在争议。本工作在严格控制碳含量和表面官能团的基础上,选择沥青(Pitch)和酚醛树脂(PR)作为有序碳和无序碳的前驱体,制备了硅碳复合材料(Si@C)并系统地研究了其电化学行为。有序的晶体结构有利于复合物中的电子传输,中孔和大孔有利于锂离子的扩散。具有有序结构和小孔容的碳质涂层为Si的膨胀提供了很好的缓冲,电极在50次循环后仍保持结构完整性。然而,无序和多孔的结构降低了结构的稳定性并产生了很大的极化,这使得循环过程中体积不断膨胀,导致电化学性能较差。Si@C-Pitch在5 A g^(−1)下的容量是Si@C-PR的8倍,在0.5 A g^(−1)下100次循环后的容量保持率是Si@C-PR的1.9倍。该研究可为Si@C负极中炭材料的选择提供了理论指导。
基金supported by the National Natural Science Foundation of China(No.51174028)the Beijing Natural Science Foundation(No.2102029)
文摘To fabricate electronic packaging shell of coppermatrix composite with characteristics of high ther mal conductivity and low thermal expansion coefficient, semisolid forming technology, and powder metallurgy was combined. Conventional mechanical mixing of Cu and SiC could have insufficient wettability, and a new method of semisolid processing was introduced for billets preparation. The SiC/Cu composites were first prepared by PM, and then, semisolid reheating was performed for the successive semisolid forging. Composite billets with SiC 35 % vol ume fraction were compacted and sintered pressurelessly, microstructure analysis showed that the composites pre pared by PM had high density, and the combination between SiC particles and Cualloy was good. Semisolid reheating was the crucial factor in determining the micro structure and thixotropic property of the billet. An opti mised reheating strategy was proposed： temperature 1,025 ℃and holding time 5 min.
