Hydroxypropyl guar gum was prepared based on the reaction of guar gum and propylene oxide.The value of molar substitution was 0.32 and the proportion of two sorts single sugar was 1∶1.67 determined by （）1H-NMR.（）...Hydroxypropyl guar gum was prepared based on the reaction of guar gum and propylene oxide.The value of molar substitution was 0.32 and the proportion of two sorts single sugar was 1∶1.67 determined by （）1H-NMR.（）13C-NMR can be used to assume the connection between guar gum and Hydroxypropyl and evaluate the length of hydroxypropyl which was 2～8.展开更多
为有效控制和降低压裂液对储层的伤害,进一步提高压裂液效果,降低压裂成本,开发了满足低渗透储层压裂需要的低质量分数、低残渣、低伤害的胍胶压裂液体系。该压裂液体系胍胶浓度为0.35%,交联剂用量为0.50%,破胶后残渣为144 mg/L,破胶剂...为有效控制和降低压裂液对储层的伤害,进一步提高压裂液效果,降低压裂成本,开发了满足低渗透储层压裂需要的低质量分数、低残渣、低伤害的胍胶压裂液体系。该压裂液体系胍胶浓度为0.35%,交联剂用量为0.50%,破胶后残渣为144 mg/L,破胶剂用量为0.008%,破胶时间为3 h,与常规胍胶体系相比破胶残渣下降率为51.52%,起泡剂、黏土稳定剂、助排剂用量均为0.50%,温度稳定剂为0.10%。流变等研究分析结果表明该体系具有良好的抗温抗剪切能力,当温度达到140℃时黏度大于100 m Pa·s,在170 s^(-1)剪切90 min后黏度大于80 m Pa·s。通过对岩心伤害率与静态滤失进行研究发现伤害率下降均大于50%,静态滤失较小,有利于降低对储层的伤害。展开更多
为提高稠化剂的抗温性,以羟丙基瓜胶、2-吡咯烷酮和(2-氯乙基)三甲基氯化铵为原料,合成了新型改性羟丙基瓜胶稠化剂。采用TGA进行了抗温性能评价,研究了稠化剂的交联条件以及压裂液的耐温耐剪切性能、破胶性能、残渣含量和岩心伤害评价...为提高稠化剂的抗温性,以羟丙基瓜胶、2-吡咯烷酮和(2-氯乙基)三甲基氯化铵为原料,合成了新型改性羟丙基瓜胶稠化剂。采用TGA进行了抗温性能评价,研究了稠化剂的交联条件以及压裂液的耐温耐剪切性能、破胶性能、残渣含量和岩心伤害评价等。结果表明,羟丙基瓜胶通过引入刚性基团改性后,热降解温度提高到了220℃,在0.6%的加量下增黏效果好。压裂液体系优选配方为:0.6%改性羟丙基瓜胶+0.5%高温防膨剂BZGCY-C-FP+0.5%高温助排剂BZGCYC-ZP+0.1%温度稳定剂BZGCY-Y-WD+0.2%碳酸钠+清水+有机硼锆交联剂BH-GWJL(交联比为100∶0.4),在200℃、170 s^(-1)下剪切120 min后黏度保持在60 m Pa·s以上,提高了稳定性。现场应用效果表明,该体系能够满足高温井施工要求。展开更多
HGG (Hydroxypropyl guar gum) was synthesized by phase transfer catalysis for the first time. The effects of alkalinity, phase transfer catalyst, etherification, pH value, temperature, reaction time and stirring spee...HGG (Hydroxypropyl guar gum) was synthesized by phase transfer catalysis for the first time. The effects of alkalinity, phase transfer catalyst, etherification, pH value, temperature, reaction time and stirring speed were investigated. An optimal synthetic reaction technology was established, namely, dose of guar gum is 100 g, propylene oxide 40-50 g, HTAC (hexadecyl trimethyl ammonium chloride ) 1.3-1.7 g, pH value 10-10.5, temperature 45-50℃, and reaction time 3-4 hours. The result shows that the improved HGG has high viscosity. Its dissolution speed, content of insoluble residue, colloid light transparency and stability are apparently superior to guar flour.展开更多
文摘Hydroxypropyl guar gum was prepared based on the reaction of guar gum and propylene oxide.The value of molar substitution was 0.32 and the proportion of two sorts single sugar was 1∶1.67 determined by （）1H-NMR.（）13C-NMR can be used to assume the connection between guar gum and Hydroxypropyl and evaluate the length of hydroxypropyl which was 2～8.
文摘为有效控制和降低压裂液对储层的伤害,进一步提高压裂液效果,降低压裂成本,开发了满足低渗透储层压裂需要的低质量分数、低残渣、低伤害的胍胶压裂液体系。该压裂液体系胍胶浓度为0.35%,交联剂用量为0.50%,破胶后残渣为144 mg/L,破胶剂用量为0.008%,破胶时间为3 h,与常规胍胶体系相比破胶残渣下降率为51.52%,起泡剂、黏土稳定剂、助排剂用量均为0.50%,温度稳定剂为0.10%。流变等研究分析结果表明该体系具有良好的抗温抗剪切能力,当温度达到140℃时黏度大于100 m Pa·s,在170 s^(-1)剪切90 min后黏度大于80 m Pa·s。通过对岩心伤害率与静态滤失进行研究发现伤害率下降均大于50%,静态滤失较小,有利于降低对储层的伤害。
文摘为提高稠化剂的抗温性,以羟丙基瓜胶、2-吡咯烷酮和(2-氯乙基)三甲基氯化铵为原料,合成了新型改性羟丙基瓜胶稠化剂。采用TGA进行了抗温性能评价,研究了稠化剂的交联条件以及压裂液的耐温耐剪切性能、破胶性能、残渣含量和岩心伤害评价等。结果表明,羟丙基瓜胶通过引入刚性基团改性后,热降解温度提高到了220℃,在0.6%的加量下增黏效果好。压裂液体系优选配方为:0.6%改性羟丙基瓜胶+0.5%高温防膨剂BZGCY-C-FP+0.5%高温助排剂BZGCYC-ZP+0.1%温度稳定剂BZGCY-Y-WD+0.2%碳酸钠+清水+有机硼锆交联剂BH-GWJL(交联比为100∶0.4),在200℃、170 s^(-1)下剪切120 min后黏度保持在60 m Pa·s以上,提高了稳定性。现场应用效果表明,该体系能够满足高温井施工要求。
文摘HGG (Hydroxypropyl guar gum) was synthesized by phase transfer catalysis for the first time. The effects of alkalinity, phase transfer catalyst, etherification, pH value, temperature, reaction time and stirring speed were investigated. An optimal synthetic reaction technology was established, namely, dose of guar gum is 100 g, propylene oxide 40-50 g, HTAC (hexadecyl trimethyl ammonium chloride ) 1.3-1.7 g, pH value 10-10.5, temperature 45-50℃, and reaction time 3-4 hours. The result shows that the improved HGG has high viscosity. Its dissolution speed, content of insoluble residue, colloid light transparency and stability are apparently superior to guar flour.
