Effect of direct current electric field （DCEF） on corrosion behaviour of copper printed circuit board （PCB-Cu）, Cl-ion migration behaviour, dendrites growth under thin electrolyte layer was investigated using pote...Effect of direct current electric field （DCEF） on corrosion behaviour of copper printed circuit board （PCB-Cu）, Cl-ion migration behaviour, dendrites growth under thin electrolyte layer was investigated using potentiodynamic polarization and scanning electron microscopy （SEM） with energy dispersive spectrometer （EDS）. Results indicate that DCEF decreases the corrosion of PCB-Cu;Cl-ions directionally migrate from the negative pole to the positive pole, and enrich on the surface of the positive pole, which causes serious localized corrosion; dendrites grow on the surface of the negative pole, and the rate and scale of dendrite growth become faster and greater with the increase of external voltage and exposure time, respectively.展开更多
In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding ...In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.展开更多
Carbon nanotubes （CNTs） were coated by tungsten layer using metal organic chemical vapor deposition process with tungsten hexacarbonyl as a precursor. The W-coated CNTs （W-CNTs） were dispersed into Cu powders by m...Carbon nanotubes （CNTs） were coated by tungsten layer using metal organic chemical vapor deposition process with tungsten hexacarbonyl as a precursor. The W-coated CNTs （W-CNTs） were dispersed into Cu powders by magnetic stirring process and then the mixed powders were consolidated by spark plasma sintering to fabricate W-CNTs/Cu composites. The CNTs/Cu composites were fabricated using the similafprocesses. The friction coefficient and mass wear loss of W-CNTs/Cu and CNTs/Cu composites were studied. The results showed that the W-CNT content, interfacial bonding situation, and applied load could influence the friction coefficient and wear loss of W-CNTs/Cu com- posites. When the W-CNT content was 1.0 wt.%, the W-CNTs/Cu composites got the minimum friction coefficient and wear loss, which were decreased by 72.1% and 47.6%, respectively, compared with pure Cu specimen. The friction coefficient and wear loss of W-CNTs/Cu composites were lower than those of CNTs/Cu composites, which was due to that the interracial bonding at （W-CNTs）-Cu interface was better than that at CNTs-Cu interface. The friction coefficient of composites did not vary obviously with increasing applied load, while the wear loss of composites increased significantly with the increase of applied load.展开更多
基金Project(50871044)supported by the National Natural Science Foundation of ChinaProject(2012M511207)supported by the Postdoctoral Science Foundation of ChinaProject(10122011)supported by the Science Research Foundation of Wuhan Institute Technology,China
文摘Effect of direct current electric field （DCEF） on corrosion behaviour of copper printed circuit board （PCB-Cu）, Cl-ion migration behaviour, dendrites growth under thin electrolyte layer was investigated using potentiodynamic polarization and scanning electron microscopy （SEM） with energy dispersive spectrometer （EDS）. Results indicate that DCEF decreases the corrosion of PCB-Cu;Cl-ions directionally migrate from the negative pole to the positive pole, and enrich on the surface of the positive pole, which causes serious localized corrosion; dendrites grow on the surface of the negative pole, and the rate and scale of dendrite growth become faster and greater with the increase of external voltage and exposure time, respectively.
基金support rendered through a Major Research Project No. F-31-51/2005(SR)
文摘In many circumstances,dissimilar metals have to be bonded together and the resulting joint interfaces must typically sustain mechanical and/or electrical forces without failure,which is not possible by fusion welding processes.The melting points of magnesium(Mg)and copper(Cu)have a significant difference(nearly 400℃)and this may lead to a large difference in the microstructure and joint performance of Mg-Cu joints.However,diffusion bonding can be used to join these alloys without much difficulty.This work analyses the effect of parameters on diffusion layer thickness,hardness and strength of magnesium-copper dissimilar joints.The experiments were conducted using three-factor,five-level,central composite rotatable design matrix.Empirical relationships were developed to predict diffusion layer thickness,hardness and strength using response surface methodology.It is found that bonding temperature has predominant effect on bond characteristics.Joints fabricated at a bonding temperature of 450℃, bonding pressure of 12 MPa and bonding time of 30 min exhibited maximum shear strength and bonding strength of 66 and 81 MPa, respectively.
基金financially supported by the National Natural Science Foundation of China (No.50971020)National HighTech Research and Development Program of China (No.2009AA03Z116)
文摘Carbon nanotubes （CNTs） were coated by tungsten layer using metal organic chemical vapor deposition process with tungsten hexacarbonyl as a precursor. The W-coated CNTs （W-CNTs） were dispersed into Cu powders by magnetic stirring process and then the mixed powders were consolidated by spark plasma sintering to fabricate W-CNTs/Cu composites. The CNTs/Cu composites were fabricated using the similafprocesses. The friction coefficient and mass wear loss of W-CNTs/Cu and CNTs/Cu composites were studied. The results showed that the W-CNT content, interfacial bonding situation, and applied load could influence the friction coefficient and wear loss of W-CNTs/Cu com- posites. When the W-CNT content was 1.0 wt.%, the W-CNTs/Cu composites got the minimum friction coefficient and wear loss, which were decreased by 72.1% and 47.6%, respectively, compared with pure Cu specimen. The friction coefficient and wear loss of W-CNTs/Cu composites were lower than those of CNTs/Cu composites, which was due to that the interracial bonding at （W-CNTs）-Cu interface was better than that at CNTs-Cu interface. The friction coefficient of composites did not vary obviously with increasing applied load, while the wear loss of composites increased significantly with the increase of applied load.
