The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-...The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.展开更多
Metamaterials with higher-order topological band gaps that exhibit topological physics beyond the bulkedge correspondence provide unique application values due to their ability of integrating topological boundary stat...Metamaterials with higher-order topological band gaps that exhibit topological physics beyond the bulkedge correspondence provide unique application values due to their ability of integrating topological boundary states at multiple dimensions in a single chip.On the other hand,in the past decade,micromechanical metamaterials are developing rapidly for various applications such as micro-piezoelectricgenerators,intelligent micro-systems,on-chip sensing and self-powered micro-systems.To empower these cutting-edge applications with topological manipulations of elastic waves,higher-order topological mechanical systems working at high frequencies(MHz)with high quality-factors are demanded.The current realizations of higher-order topological mechanical systems,however,are still limited to systems with large scales(centimetres)and low frequencies(k Hz).Here,we report the first experimental realization of an on-chip micromechanical metamaterial as the higher-order topological insulator for elastic waves at MHz.The higher-order topological phononic band gap is induced by the band inversion at the Brillouin zone corner which is achieved by configuring the orientations of the elliptic pillars etched on the silicon chip.With consistent experiments,theory and simulations,we demonstrate the emergence of coexisting topological edge and corner states in a single silicon chip as induced by the higher-order band topology.The experimental realization of on-chip micromechanical metamaterials with higherorder topology opens a new regime for materials and applications based on topological elastic waves.展开更多
Using an in-house MMIC and an off-chip,high-quality varactor, a novel wide band VCO covered Ku band is introduced. In contrast to HMIC technology, this method reduces the complexity of microchip assembly. More importa...Using an in-house MMIC and an off-chip,high-quality varactor, a novel wide band VCO covered Ku band is introduced. In contrast to HMIC technology, this method reduces the complexity of microchip assembly. More importantly,it overcomes the constraint that the standard commercial GaAs pHEMT MMIC process is usually not compatible with highquality varactors for VCO,and it significantly improves the phase noise and frequency tuning linearity performances compared to either MMIC or HMIC implementation. It is a novel and high-quality method to develop microwave and millimeter wave VCO.展开更多
为满足卫星通信中双频共口径、高集成、多波束等要求,提出了一种基于封装天线(Antenna in Package, AIP)架构的Ka频段收发共口径多波束相控阵天线。天线以双频堆叠微带单元的形式实现了收发共口径,并通过天线集成滤波器保证了收发通道...为满足卫星通信中双频共口径、高集成、多波束等要求,提出了一种基于封装天线(Antenna in Package, AIP)架构的Ka频段收发共口径多波束相控阵天线。天线以双频堆叠微带单元的形式实现了收发共口径,并通过天线集成滤波器保证了收发通道的隔离度优于44 dB。在±60°范围内,64元接收阵增益优于17.4 dB,128元发射阵增益优于20.2 dB,具有良好的波束扫描性能。为获得收发多波束一片式集成,在收发(Transmitter/Receiver, T/R)组件中使用晶圆级三维系统集成封装(Three Dimensions System in Package, 3D-SIP)并结合微凸点的制备技术,保证了系统级芯片(System-on-Chip, SOC)的高密度二次集成。高低频混压技术同样被应用于阵面、收发网络、控制供电链路的多层板集成。所提多波束的相控阵天线新架构具有高密度集成TR组件、多波束一体化、高效散热等特点,在卫星通信和数据链等方面具有广阔的应用前景。展开更多
文摘The idea of Ku-band transceiver frequency conversion module design based on 3D micropackaging technology is proposed. By using the double frequency conversion technology,the dual transceiver circuit from Ku-band to L-band is realized by combining with the local oscillator and the power control circuit to complete functions such as amplification, filtering and gain. In order to achieve the performance optimization and a high level of integration of the Ku-band monolithic microwave integrated circuits(MMIC) operating chip, the 3 D vertical interconnection micro-assembly technology is used. By stacking solder balls on the printed circuit board(PCB), the technology decreases the volume of the original transceiver to a miniaturized module. The module has a good electromagnetic compatibility through special structure designs. This module has the characteristics of miniaturization, low power consumption and high density, which is suitable for popularization in practical application.
基金supported by the Natural Science Foundation of Guangdong Province(2020A1515010549)China Postdoctoral Science Foundation(2020M672615 and 2019M662885)+1 种基金National Postdoctoral Program for Innovative Talents(BX20190122)the Jiangsu specially-appointed professor funding。
文摘Metamaterials with higher-order topological band gaps that exhibit topological physics beyond the bulkedge correspondence provide unique application values due to their ability of integrating topological boundary states at multiple dimensions in a single chip.On the other hand,in the past decade,micromechanical metamaterials are developing rapidly for various applications such as micro-piezoelectricgenerators,intelligent micro-systems,on-chip sensing and self-powered micro-systems.To empower these cutting-edge applications with topological manipulations of elastic waves,higher-order topological mechanical systems working at high frequencies(MHz)with high quality-factors are demanded.The current realizations of higher-order topological mechanical systems,however,are still limited to systems with large scales(centimetres)and low frequencies(k Hz).Here,we report the first experimental realization of an on-chip micromechanical metamaterial as the higher-order topological insulator for elastic waves at MHz.The higher-order topological phononic band gap is induced by the band inversion at the Brillouin zone corner which is achieved by configuring the orientations of the elliptic pillars etched on the silicon chip.With consistent experiments,theory and simulations,we demonstrate the emergence of coexisting topological edge and corner states in a single silicon chip as induced by the higher-order band topology.The experimental realization of on-chip micromechanical metamaterials with higherorder topology opens a new regime for materials and applications based on topological elastic waves.
文摘Using an in-house MMIC and an off-chip,high-quality varactor, a novel wide band VCO covered Ku band is introduced. In contrast to HMIC technology, this method reduces the complexity of microchip assembly. More importantly,it overcomes the constraint that the standard commercial GaAs pHEMT MMIC process is usually not compatible with highquality varactors for VCO,and it significantly improves the phase noise and frequency tuning linearity performances compared to either MMIC or HMIC implementation. It is a novel and high-quality method to develop microwave and millimeter wave VCO.
文摘为满足卫星通信中双频共口径、高集成、多波束等要求,提出了一种基于封装天线(Antenna in Package, AIP)架构的Ka频段收发共口径多波束相控阵天线。天线以双频堆叠微带单元的形式实现了收发共口径,并通过天线集成滤波器保证了收发通道的隔离度优于44 dB。在±60°范围内,64元接收阵增益优于17.4 dB,128元发射阵增益优于20.2 dB,具有良好的波束扫描性能。为获得收发多波束一片式集成,在收发(Transmitter/Receiver, T/R)组件中使用晶圆级三维系统集成封装(Three Dimensions System in Package, 3D-SIP)并结合微凸点的制备技术,保证了系统级芯片(System-on-Chip, SOC)的高密度二次集成。高低频混压技术同样被应用于阵面、收发网络、控制供电链路的多层板集成。所提多波束的相控阵天线新架构具有高密度集成TR组件、多波束一体化、高效散热等特点,在卫星通信和数据链等方面具有广阔的应用前景。
