摘要
为满足卫星通信中双频共口径、高集成、多波束等要求,提出了一种基于封装天线(Antenna in Package, AIP)架构的Ka频段收发共口径多波束相控阵天线。天线以双频堆叠微带单元的形式实现了收发共口径,并通过天线集成滤波器保证了收发通道的隔离度优于44 dB。在±60°范围内,64元接收阵增益优于17.4 dB,128元发射阵增益优于20.2 dB,具有良好的波束扫描性能。为获得收发多波束一片式集成,在收发(Transmitter/Receiver, T/R)组件中使用晶圆级三维系统集成封装(Three Dimensions System in Package, 3D-SIP)并结合微凸点的制备技术,保证了系统级芯片(System-on-Chip, SOC)的高密度二次集成。高低频混压技术同样被应用于阵面、收发网络、控制供电链路的多层板集成。所提多波束的相控阵天线新架构具有高密度集成TR组件、多波束一体化、高效散热等特点,在卫星通信和数据链等方面具有广阔的应用前景。
A multi-beam phased array antenna architecture based on antenna in package(AIP)in Ka-band is proposed to meet the requirements of dual-frequency common aperture,high integration and multi-beam in satellite communication.The antenna realizes the share-aperture of transceiver by dual-frequency stacked micro strip cell,the isolation of transceiver channel is better than 44 dB through antenna integrated filter.In+60°,the gain of 64-element receiver array is better than 17.4 dB and the gain of I 28-element transmitter array is better than 20.2 dB.And it has good beam-scanning performance.In order to obtain one-piece integration of transceiver and multi-beam,wafer-level 3D system-in-package(3D-SIP)is used in the transmitter-receiver(TR)module and combined with micro-bump preparation technology to guarantee high-density secondary integration at system-on-chip(SOC).The technique of high and low frequency hybridization is also employed for the multilayer board integration of the radiating array.surface,transceiver network,and power supply control link.The proposed new architecture of multi-beam phased array antenna is characterized by high-density integrated TR components,multi-beam integration,and high-efficiency heat dissipation,etc.It has wide application prospect in satellite communication and data link.
作者
蓝海
王子宁
LAN Hai;WANG Zining(Southwest China Institute of Electronic Technology,Chengdu 2.Unit 610036,China;93129 of PLA,Beijing 100076,China)
出处
《电讯技术》
北大核心
2024年第8期1322-1327,共6页
Telecommunication Engineering
