As the core components of fifth-generation(5G)communication technology,optical modules should be consistently miniaturized in size while improving their level of integration.This inevitably leads to a dramatic spike i...As the core components of fifth-generation(5G)communication technology,optical modules should be consistently miniaturized in size while improving their level of integration.This inevitably leads to a dramatic spike in power consumption and a consequent increase in heat flow density when operating in a confined space.To ensure a successful start-up and operation of 5G optical modules,active cooling and precise temperature control via the Peltier effect in confined space is essential yet challenging.In this work,p-type Bi_(0.5)Sb_(1.5)Te_(3)and n-type Bi_(2)Te_(2.7)Se_(0.3)bulk thermoelectric(TE)materials are used,and a micro thermoelectric thermostat(micro-TET)(device size,2×9.3×1.1mm^(3);leg size,0.4×0.4×0.5mm^(3);number of legs,44)is successfully integrated into a 5G optical module with Quad Small Form Pluggable 28 interface.As a result,the internal temperature of this kind of optical module is always maintained at 45.7℃ and the optical power is up to 7.4 dBm.Furthermore,a multifactor design roadmap is created based on a 3D numerical model using the ANSYS finite element method,taking into account the number of legs(N),leg width(W),leg length(L),filling atmosphere,electric contact resistance(Rec),thermal contact resistance(Rtc),ambient temperature(Ta),and the heat generated by the laser source(QL).It facilitates the integrated fabrication of micro-TET,and shows the way to enhance packaging and performance under different operating conditions.According to the roadmap,the micro-TET(2×9.3×1mm^(3),W=0.3 mm,L=0.4 mm,N=68 legs)is fabricated and consumes only 0.89W in cooling mode(Q_(L)=0.7W,T_(a)=80℃)and 0.36Win heating mode(T_(a)=0℃)to maintain the laser temperature of 50℃.This research will hopefully be applied to other microprocessors for precise temperature control and integrated manufacturing.展开更多
5G网络建设和大规模数据中心建设带来了大量光模块需求。在光模块生产制造中,为了保障光模块在环境温度变化情况下能够长时间正常工作,需要检测模块在不同温度下的性能,而进行高低温测试。高低温测试在光模块制造成本中占了很大比重。...5G网络建设和大规模数据中心建设带来了大量光模块需求。在光模块生产制造中,为了保障光模块在环境温度变化情况下能够长时间正常工作,需要检测模块在不同温度下的性能,而进行高低温测试。高低温测试在光模块制造成本中占了很大比重。设计了一种基于半导体制冷器(Thermo Electric Cooler)的光模块高低温测试系统,相较传统基于热流仪的方案,不需要压缩空气,能够大幅降低功耗、噪声和整体成本,且能够实现与热流仪相当的升降温时间。该系统对于节能减排、降低光模块制造成本有重要意义。展开更多
基金National Key Research and Development Program of China,Grant/Award Number:2019YFA0704900National Natural Science Foundation of China,Grant/Award Number:52202289。
文摘As the core components of fifth-generation(5G)communication technology,optical modules should be consistently miniaturized in size while improving their level of integration.This inevitably leads to a dramatic spike in power consumption and a consequent increase in heat flow density when operating in a confined space.To ensure a successful start-up and operation of 5G optical modules,active cooling and precise temperature control via the Peltier effect in confined space is essential yet challenging.In this work,p-type Bi_(0.5)Sb_(1.5)Te_(3)and n-type Bi_(2)Te_(2.7)Se_(0.3)bulk thermoelectric(TE)materials are used,and a micro thermoelectric thermostat(micro-TET)(device size,2×9.3×1.1mm^(3);leg size,0.4×0.4×0.5mm^(3);number of legs,44)is successfully integrated into a 5G optical module with Quad Small Form Pluggable 28 interface.As a result,the internal temperature of this kind of optical module is always maintained at 45.7℃ and the optical power is up to 7.4 dBm.Furthermore,a multifactor design roadmap is created based on a 3D numerical model using the ANSYS finite element method,taking into account the number of legs(N),leg width(W),leg length(L),filling atmosphere,electric contact resistance(Rec),thermal contact resistance(Rtc),ambient temperature(Ta),and the heat generated by the laser source(QL).It facilitates the integrated fabrication of micro-TET,and shows the way to enhance packaging and performance under different operating conditions.According to the roadmap,the micro-TET(2×9.3×1mm^(3),W=0.3 mm,L=0.4 mm,N=68 legs)is fabricated and consumes only 0.89W in cooling mode(Q_(L)=0.7W,T_(a)=80℃)and 0.36Win heating mode(T_(a)=0℃)to maintain the laser temperature of 50℃.This research will hopefully be applied to other microprocessors for precise temperature control and integrated manufacturing.
文摘5G网络建设和大规模数据中心建设带来了大量光模块需求。在光模块生产制造中,为了保障光模块在环境温度变化情况下能够长时间正常工作,需要检测模块在不同温度下的性能,而进行高低温测试。高低温测试在光模块制造成本中占了很大比重。设计了一种基于半导体制冷器(Thermo Electric Cooler)的光模块高低温测试系统,相较传统基于热流仪的方案,不需要压缩空气,能够大幅降低功耗、噪声和整体成本,且能够实现与热流仪相当的升降温时间。该系统对于节能减排、降低光模块制造成本有重要意义。