The formation mechanisms and growth kinetics of Al3 Ni and Al3Ni2 in Ni-Al diffusion couple prepared by electrodeposition of Ni on Al substrate were investigated. The nickel coating with 20 μm thickness was applied o...The formation mechanisms and growth kinetics of Al3 Ni and Al3Ni2 in Ni-Al diffusion couple prepared by electrodeposition of Ni on Al substrate were investigated. The nickel coating with 20 μm thickness was applied on 6061 aluminum alloy by direct current electroplating. The samples were then heat-treated for different durations at 450, 500 and 550 °C under argon atmosphere. The intermetallic phases were identified by means of scanning electron microscopy（SEM）, energy dispersive spectrometry（EDS） and X-ray diffraction（XRD）. The results showed that the formation of intermetallic phases consisted of two important steps. The first step was the lateral growth of intermetallic phase from separate sites, resulting in the formation of a continuous layer. The second step was the growth of the continuous intermetallic layer in the direction perpendicular to the interface. However, excessive increase in thickness of intermetallic phases led to the detachment of reaction products, i.e., Al3 Ni and Al3Ni2, from the substrate. It was also observed that aluminum was the dominant diffusing element during Al3 Ni growth, while nickel diffusion was dominant during Al3Ni2 growth. The growth kinetics of both Al3 Ni and Al3Ni2 phases obeyed a parabolic law.展开更多
The density of Ni-AI alloys in both liquid state and solid-liquid coexistence state was measured with a modified pycnometric method. It was found that the density of Ni-AI alloys decreases with increasing temperature ...The density of Ni-AI alloys in both liquid state and solid-liquid coexistence state was measured with a modified pycnometric method. It was found that the density of Ni-AI alloys decreases with increasing temperature and Al concentration in the alloys. The molar volume of liquid Ni-AI binary alloys increases with the increase of temperature and Al concentration. The partial molar volume of Al in Ni-AI binary alloy was calculated approximately. The molar volume of liquid Ni-AI alloy determined in the present work shows a negative deviation from the ideal linear molar volume.展开更多
In order to improve the wear resistance properties of copper substrate, a layer of electroplated nickel was firstly deposited on copper substrate, subsequently these electroplated specimens were treated by slurry pack...In order to improve the wear resistance properties of copper substrate, a layer of electroplated nickel was firstly deposited on copper substrate, subsequently these electroplated specimens were treated by slurry pack cementation process with a slurry pack cementation mixture composed of TiO2 as titanizing source, pure Al powder as aluminzing source and also a reducer for titanizing, an activator of NH4Cl and albumen （egg white） as cohesive agent. The Ti-Al coating was fabricated on the surface of electro-deposited nickel layer on copper matrix followed by the slurry pack cementation process. The effects of slurry pack cementation temperature on the microstructures and wear resistance of Ti-Al coating were studied. The results show that the microstructure of the coating changed from NiAl＋Ni3（Ti,Al） to NiAl ＋Ni3（Ti,Al）＋Ni4Ti3 to Ni4Ti3＋NiAl, and to NiAl＋Ni3（Ti,Al）＋NiTi with slurry pack cementation temperature ranging from 800 ℃ to 950 ℃ in 12 h. The friction coefficient of Ti-Al coating decreased and the hardness increased with increasing the slurry pack cementation temperature. The minimum friction coefficient was 1/3 and the minimum hardness was 5 times larger than that of pure copper.展开更多
Characteristics of carbon deposition of CH 4 and C 2H 4 decomposition over supported Ni and Ni Ce catalysts were studied by using a pulse reaction as well as BET, TPR, XPS and hydrogen chemisorption techniques. It...Characteristics of carbon deposition of CH 4 and C 2H 4 decomposition over supported Ni and Ni Ce catalysts were studied by using a pulse reaction as well as BET, TPR, XPS and hydrogen chemisorption techniques. It is found that there is a metal semiconductor interaction (MScI) in the Ni Ce catalyst, and the effect of MScI on the carbon deposition of CH 4 decomposition is opposite to that of C 2H 4. A novel model of carbon deposition of CH 4 or C 2H 4 decomposition was proposed.展开更多
基金Projects(51072104,51272141)supported by the National Natural Science Foundation of ChinaProject(ts20110828)supported by Taishan Scholars Project of Shandong Province,ChinaProject(BS2010CL038)supported by the Research Award Fund for Outstanding Young and Middle-aged Scientists of Shandong Province,China
文摘The formation mechanisms and growth kinetics of Al3 Ni and Al3Ni2 in Ni-Al diffusion couple prepared by electrodeposition of Ni on Al substrate were investigated. The nickel coating with 20 μm thickness was applied on 6061 aluminum alloy by direct current electroplating. The samples were then heat-treated for different durations at 450, 500 and 550 °C under argon atmosphere. The intermetallic phases were identified by means of scanning electron microscopy（SEM）, energy dispersive spectrometry（EDS） and X-ray diffraction（XRD）. The results showed that the formation of intermetallic phases consisted of two important steps. The first step was the lateral growth of intermetallic phase from separate sites, resulting in the formation of a continuous layer. The second step was the growth of the continuous intermetallic layer in the direction perpendicular to the interface. However, excessive increase in thickness of intermetallic phases led to the detachment of reaction products, i.e., Al3 Ni and Al3Ni2, from the substrate. It was also observed that aluminum was the dominant diffusing element during Al3 Ni growth, while nickel diffusion was dominant during Al3Ni2 growth. The growth kinetics of both Al3 Ni and Al3Ni2 phases obeyed a parabolic law.
文摘The density of Ni-AI alloys in both liquid state and solid-liquid coexistence state was measured with a modified pycnometric method. It was found that the density of Ni-AI alloys decreases with increasing temperature and Al concentration in the alloys. The molar volume of liquid Ni-AI binary alloys increases with the increase of temperature and Al concentration. The partial molar volume of Al in Ni-AI binary alloy was calculated approximately. The molar volume of liquid Ni-AI alloy determined in the present work shows a negative deviation from the ideal linear molar volume.
基金Projects(YKJ201203,CKJB201205)supported by the Nanjing Institute of Technology,China
文摘In order to improve the wear resistance properties of copper substrate, a layer of electroplated nickel was firstly deposited on copper substrate, subsequently these electroplated specimens were treated by slurry pack cementation process with a slurry pack cementation mixture composed of TiO2 as titanizing source, pure Al powder as aluminzing source and also a reducer for titanizing, an activator of NH4Cl and albumen （egg white） as cohesive agent. The Ti-Al coating was fabricated on the surface of electro-deposited nickel layer on copper matrix followed by the slurry pack cementation process. The effects of slurry pack cementation temperature on the microstructures and wear resistance of Ti-Al coating were studied. The results show that the microstructure of the coating changed from NiAl＋Ni3（Ti,Al） to NiAl ＋Ni3（Ti,Al）＋Ni4Ti3 to Ni4Ti3＋NiAl, and to NiAl＋Ni3（Ti,Al）＋NiTi with slurry pack cementation temperature ranging from 800 ℃ to 950 ℃ in 12 h. The friction coefficient of Ti-Al coating decreased and the hardness increased with increasing the slurry pack cementation temperature. The minimum friction coefficient was 1/3 and the minimum hardness was 5 times larger than that of pure copper.
文摘Characteristics of carbon deposition of CH 4 and C 2H 4 decomposition over supported Ni and Ni Ce catalysts were studied by using a pulse reaction as well as BET, TPR, XPS and hydrogen chemisorption techniques. It is found that there is a metal semiconductor interaction (MScI) in the Ni Ce catalyst, and the effect of MScI on the carbon deposition of CH 4 decomposition is opposite to that of C 2H 4. A novel model of carbon deposition of CH 4 or C 2H 4 decomposition was proposed.
