Highly oriented MgO(111)and MgO(100)thin films have been deposited on Si(111)and Si(100)substrates by using Low Pressure MOCVD(LPMOCVD).Magnesium 2,4-pentanedionate was used as the source ma- terial.The films have a v...Highly oriented MgO(111)and MgO(100)thin films have been deposited on Si(111)and Si(100)substrates by using Low Pressure MOCVD(LPMOCVD).Magnesium 2,4-pentanedionate was used as the source ma- terial.The films have a very smooth surface morphology and optical transparency with an index of refraction of 1.71(632.8 nm).Typical growth rate of the films is 1.0 μm/h.The data of X-ray diffraction analysis indi- cate that the films are fully textured with(111)and(100)orientation perpendicular to the substrate surface respectively.The main parameters having influence on the deposition are the substrate temperature,the total pressure in the reaction chamber,the reaction gases and its flowrate.展开更多
This study investigated the effects of annealing and discharging on the characteristics of MgO thin films prepared by ion beam-assisted deposition as a protective layer of AC-PDP. By an annealing process at a temperat...This study investigated the effects of annealing and discharging on the characteristics of MgO thin films prepared by ion beam-assisted deposition as a protective layer of AC-PDP. By an annealing process at a temperature of 450 ℃ for more than three hours, the crystallinity of the deposited MgO films was improved, but the surface of the （200）-oriented MgO thin films in the vicinity of the discharge electrodes, especially on the inner sides of the electrodes, was subjected to crack formation to the compressive stress of The failure mechanism of the MgO films plus the additional （200）-oriented MgO films was due compressive stress induced by the differences in the coefficient of thermal expansion between the electrode and the dielectric layer. In the discharging process, all MgO films were eroded unevenly, and the serious erosion occurred near the edges of the discharge electrodes. ATM（atomic force microscopy） images show that the eroded surface of the （200）-oriented MgO thin film is smoother than that of the （111）-oriented fihn. Also, the （200）-oriented MgO thin film shows an improved ability to resist ion erosion compared to the （111）-oriented film.展开更多
文摘Highly oriented MgO(111)and MgO(100)thin films have been deposited on Si(111)and Si(100)substrates by using Low Pressure MOCVD(LPMOCVD).Magnesium 2,4-pentanedionate was used as the source ma- terial.The films have a very smooth surface morphology and optical transparency with an index of refraction of 1.71(632.8 nm).Typical growth rate of the films is 1.0 μm/h.The data of X-ray diffraction analysis indi- cate that the films are fully textured with(111)and(100)orientation perpendicular to the substrate surface respectively.The main parameters having influence on the deposition are the substrate temperature,the total pressure in the reaction chamber,the reaction gases and its flowrate.
文摘This study investigated the effects of annealing and discharging on the characteristics of MgO thin films prepared by ion beam-assisted deposition as a protective layer of AC-PDP. By an annealing process at a temperature of 450 ℃ for more than three hours, the crystallinity of the deposited MgO films was improved, but the surface of the （200）-oriented MgO thin films in the vicinity of the discharge electrodes, especially on the inner sides of the electrodes, was subjected to crack formation to the compressive stress of The failure mechanism of the MgO films plus the additional （200）-oriented MgO films was due compressive stress induced by the differences in the coefficient of thermal expansion between the electrode and the dielectric layer. In the discharging process, all MgO films were eroded unevenly, and the serious erosion occurred near the edges of the discharge electrodes. ATM（atomic force microscopy） images show that the eroded surface of the （200）-oriented MgO thin film is smoother than that of the （111）-oriented fihn. Also, the （200）-oriented MgO thin film shows an improved ability to resist ion erosion compared to the （111）-oriented film.
