We presented a novel method for the development of a latent fingerprint by selective electrodeposition of a copper thin film from sulfate solution onto the conductive substrate between fingerprint ridges to generate a...We presented a novel method for the development of a latent fingerprint by selective electrodeposition of a copper thin film from sulfate solution onto the conductive substrate between fingerprint ridges to generate a negative image of the fingerprint deposit. After optimizing the parameters(deposition time, deposition potential, and copper concentration), the preferential electrodeposition of copper films allowed latent fingerprints on six kinds of conductive surfaces(indium/tin oxide-coated glass, silver sheet, platinum sheet, gold sheet, copper sheet, and a stainless steel coin) to be successfully developed with high resolution. In addition, this technique could also be exploited to visualize latent fingerprints on rough and dirty surfaces. The quality of the developed fingerprints was estimated visually and the morphology of the copper film was characterized by field emission scanning electron microscopy.展开更多
The BLU (back light unit) is the core component of the LCD for notebook, mobile-phone, navigation, as well as large sized TV, PID (public information display), etc. In order to enhance optical efficiency of LCD, optic...The BLU (back light unit) is the core component of the LCD for notebook, mobile-phone, navigation, as well as large sized TV, PID (public information display), etc. In order to enhance optical efficiency of LCD, optical films with the uniform prism patterns have been used for BLU by stacking two films up orthogonally. In this case, light interference-phenomenon occurred such as Morie, wet-out, u-turning, etc. It caused several problems such as low brightness, spots and stripes in LCD. Recently, the high-luminance micro complex prism patterns are actively studied to avoid the light interference-phenomenon and enhance the optical efficiency. In this study, the roll master to manufacture complex micro prism pattern film was machined by using the high precision lathe. The machined patterns on the roll master were 50, 45, 40, 35, 30, 25, 20, 15, 10 and 5 μm in the pitch with 25.0, 22.5, 20.0, 17.5, 15.0, 12.5, 10.0, 7.5, 5.0 and 2.5 μm in the peak height, respectively. The roll was 2 000 mm in length and 320 mm in diameter. The electroplated roll by copper and the natural single crystal diamond tool was used for machining the patterns. The cutting force was measured and analyzed for each cutting condition by using the dynamometer. The chips and the surfaces after being machined were analyzed by SEM and microscope.展开更多
The effect of two alkylpyridinium ionic liquids （py-iLs） including N-butylpyridinium hydrogen sulfate （BpyHSO4） and N-hexylpyridinium hydrogen sulfate （HpyHSO4） on the kinetics of copper electrodeposition from a...The effect of two alkylpyridinium ionic liquids （py-iLs） including N-butylpyridinium hydrogen sulfate （BpyHSO4） and N-hexylpyridinium hydrogen sulfate （HpyHSO4） on the kinetics of copper electrodeposition from acidic sulfate solution was investigated by cyclic voltammetry and potentiodynamic polarization measurements. Results from cyclic voltammetry indicate that these py-iLs have a pronounced inhibiting effect on CuE＋ electroreduction and there exists a typical nucleation and growth process. Kinetic parameters such as Tafel slope, transfer coefficient and exchange current density obtained from Tafel plots, lead to the conclusion that py-iLs inhibit the charge transfer by slightly changing the copper electrodeposition mechanism through their adsorption on the cathodic surface. In addition, scanning electron microscope （SEM） and X-ray diffraction analyses reveal that the presence of these additives leads to more leveled and fine-grained cathodic deposits without changing the crystal structure of the electrodeposited copper but strongly affects the crystallographic orientation by significantly inhibiting the growth of （111）, （200） and （311） planes.展开更多
A flexible copper clad laminate(FCCL) was fabricated using electroless-and electro-Cu plating processes and the effects of pre-treatment time on the adhesion strength of the FCCL were evaluated based on interfacial mo...A flexible copper clad laminate(FCCL) was fabricated using electroless-and electro-Cu plating processes and the effects of pre-treatment time on the adhesion strength of the FCCL were evaluated based on interfacial morphology.The neutralization and catalyst time were varied in the range of 0-20 min and 0.1-10 min,respectively,and the interfacial condition of the FCCL was characterized by atomic force microscopy(AFM) and X-ray photoelectron spectroscopy(XPS).It is observed that the peel strength increases significantly as the neutralization and catalyst time increase.Peel strength as high as 7.2-7.3 N/cm is obtained as the neutralization and catalyst time increase up to 20 min and 10 min,respectively,which is comparable to the strength achieved by the conventional laminating and sputtering processes.These improvements are probably due to an increase in the surface roughness of polyimide(PI),the activated surface condition,and the adsorption of palladium ions/atoms(Pd) on the PI surface which act as nucleation sites for Cu.展开更多
基金supported by the National Natural Science Foundation of China(21127007)the Scientific Research Foundation for the Returned Overseas Chinese Scholars,Ministry of Education of China
文摘We presented a novel method for the development of a latent fingerprint by selective electrodeposition of a copper thin film from sulfate solution onto the conductive substrate between fingerprint ridges to generate a negative image of the fingerprint deposit. After optimizing the parameters(deposition time, deposition potential, and copper concentration), the preferential electrodeposition of copper films allowed latent fingerprints on six kinds of conductive surfaces(indium/tin oxide-coated glass, silver sheet, platinum sheet, gold sheet, copper sheet, and a stainless steel coin) to be successfully developed with high resolution. In addition, this technique could also be exploited to visualize latent fingerprints on rough and dirty surfaces. The quality of the developed fingerprints was estimated visually and the morphology of the copper film was characterized by field emission scanning electron microscopy.
基金Project(R15-2006-022-01001-0) supported by the National Core Research Center Program from MOST and KOSEF
文摘The BLU (back light unit) is the core component of the LCD for notebook, mobile-phone, navigation, as well as large sized TV, PID (public information display), etc. In order to enhance optical efficiency of LCD, optical films with the uniform prism patterns have been used for BLU by stacking two films up orthogonally. In this case, light interference-phenomenon occurred such as Morie, wet-out, u-turning, etc. It caused several problems such as low brightness, spots and stripes in LCD. Recently, the high-luminance micro complex prism patterns are actively studied to avoid the light interference-phenomenon and enhance the optical efficiency. In this study, the roll master to manufacture complex micro prism pattern film was machined by using the high precision lathe. The machined patterns on the roll master were 50, 45, 40, 35, 30, 25, 20, 15, 10 and 5 μm in the pitch with 25.0, 22.5, 20.0, 17.5, 15.0, 12.5, 10.0, 7.5, 5.0 and 2.5 μm in the peak height, respectively. The roll was 2 000 mm in length and 320 mm in diameter. The electroplated roll by copper and the natural single crystal diamond tool was used for machining the patterns. The cutting force was measured and analyzed for each cutting condition by using the dynamometer. The chips and the surfaces after being machined were analyzed by SEM and microscope.
基金Projects(51204080, 51274108) supported by the National Natural Science Foundation of ChinaProject(2011FA009) supported by the Natural Science Foundation of Yunnan Province, ChinaProject(2011FZ020) supported by the Application Research Foundation of Yunnan Province, China
文摘The effect of two alkylpyridinium ionic liquids （py-iLs） including N-butylpyridinium hydrogen sulfate （BpyHSO4） and N-hexylpyridinium hydrogen sulfate （HpyHSO4） on the kinetics of copper electrodeposition from acidic sulfate solution was investigated by cyclic voltammetry and potentiodynamic polarization measurements. Results from cyclic voltammetry indicate that these py-iLs have a pronounced inhibiting effect on CuE＋ electroreduction and there exists a typical nucleation and growth process. Kinetic parameters such as Tafel slope, transfer coefficient and exchange current density obtained from Tafel plots, lead to the conclusion that py-iLs inhibit the charge transfer by slightly changing the copper electrodeposition mechanism through their adsorption on the cathodic surface. In addition, scanning electron microscope （SEM） and X-ray diffraction analyses reveal that the presence of these additives leads to more leveled and fine-grained cathodic deposits without changing the crystal structure of the electrodeposited copper but strongly affects the crystallographic orientation by significantly inhibiting the growth of （111）, （200） and （311） planes.
基金supported by Grant No.RTI04-03-04 from the Regional Technology Innovation Program of the Ministry of Commerce,Industry and Energy (MOCIE),Korea
文摘A flexible copper clad laminate(FCCL) was fabricated using electroless-and electro-Cu plating processes and the effects of pre-treatment time on the adhesion strength of the FCCL were evaluated based on interfacial morphology.The neutralization and catalyst time were varied in the range of 0-20 min and 0.1-10 min,respectively,and the interfacial condition of the FCCL was characterized by atomic force microscopy(AFM) and X-ray photoelectron spectroscopy(XPS).It is observed that the peel strength increases significantly as the neutralization and catalyst time increase.Peel strength as high as 7.2-7.3 N/cm is obtained as the neutralization and catalyst time increase up to 20 min and 10 min,respectively,which is comparable to the strength achieved by the conventional laminating and sputtering processes.These improvements are probably due to an increase in the surface roughness of polyimide(PI),the activated surface condition,and the adsorption of palladium ions/atoms(Pd) on the PI surface which act as nucleation sites for Cu.
