Y2001-62725-403 0118486互连延迟对芯片感应的灵敏性=Sensitivity of inter-connect dalay to on-chip inductance[会,英]/Ismail,Y.I.&Friedman,E.G.//2000 IEEE International Sym-posium on Circuits and Systems,Vol.3.—403～...Y2001-62725-403 0118486互连延迟对芯片感应的灵敏性=Sensitivity of inter-connect dalay to on-chip inductance[会,英]/Ismail,Y.I.&Friedman,E.G.//2000 IEEE International Sym-posium on Circuits and Systems,Vol.3.—403～406(HC)感应提取是高速 CMOS 电路设计中的主要问题,讨论了芯片感应的两个特性,明显简化芯片感应提取,第1特性使信号波形对感应值中误差不灵敏,特别是传播延迟和上升时间。展开更多
Y98-61438-45 9913166通过将微热管和其它高热传导率材料同微通道散热器相结合对多片组件(MCM)冷却的改进=Enhancementof multichip modules (MCMs) cooling by incorporatingmicroheatpipes and other high thermal conductivity mate-...Y98-61438-45 9913166通过将微热管和其它高热传导率材料同微通道散热器相结合对多片组件(MCM)冷却的改进=Enhancementof multichip modules (MCMs) cooling by incorporatingmicroheatpipes and other high thermal conductivity mate-rials into mierochannel heat sinks[会,英]/Marongiu,M.J.//1998 IEEE 48th Electronic Components &Technology Conference.—45～50 (AG)展开更多
The signal integrity problem in 0.18μm CMOS technology is analyzed from simulation.Several rules in this phenomenon are found by analyzing the crosstalk delay and noise,which are helpful for the future circuit design.
文摘Y2001-62725-403 0118486互连延迟对芯片感应的灵敏性=Sensitivity of inter-connect dalay to on-chip inductance[会,英]/Ismail,Y.I.&Friedman,E.G.//2000 IEEE International Sym-posium on Circuits and Systems,Vol.3.—403～406(HC)感应提取是高速 CMOS 电路设计中的主要问题,讨论了芯片感应的两个特性,明显简化芯片感应提取,第1特性使信号波形对感应值中误差不灵敏,特别是传播延迟和上升时间。
文摘Y98-61438-45 9913166通过将微热管和其它高热传导率材料同微通道散热器相结合对多片组件(MCM)冷却的改进=Enhancementof multichip modules (MCMs) cooling by incorporatingmicroheatpipes and other high thermal conductivity mate-rials into mierochannel heat sinks[会,英]/Marongiu,M.J.//1998 IEEE 48th Electronic Components &Technology Conference.—45～50 (AG)
文摘The signal integrity problem in 0.18μm CMOS technology is analyzed from simulation.Several rules in this phenomenon are found by analyzing the crosstalk delay and noise,which are helpful for the future circuit design.
