摘要
Y98-61438-45 9913166通过将微热管和其它高热传导率材料同微通道散热器相结合对多片组件(MCM)冷却的改进=Enhancementof multichip modules (MCMs) cooling by incorporatingmicroheatpipes and other high thermal conductivity mate-rials into mierochannel heat sinks[会,英]/Marongiu,M.J.//1998 IEEE 48th Electronic Components &Technology Conference.—45～50 (AG)
出处
《电子科技文摘》
1999年第8期33-33,共1页
Sci.& Tech.Abstract
