It is well known that surface roughness has a very important effect on superhydrophobicity.The Wenzel and Cassie-Baxter models,which correspond to the homogeneous and heterogeneous wetting respectively,are currently p...It is well known that surface roughness has a very important effect on superhydrophobicity.The Wenzel and Cassie-Baxter models,which correspond to the homogeneous and heterogeneous wetting respectively,are currently primary instructions for designing superhydrophobic surfaces.However,the particular drop shape that a drop exhibits might depend on how it is formed. A water drop can occupy multiple equilibrium states,which relate to different local minimal energy.In some cases,both equilibrium states can even co-exist on a same substrate.Thus the apparent contact angles may vary and have different values.We discuss how the Wenzel and Cassie-Baxter equations determine the homogeneous and heterogeneous wetting theoretically. Contact angle analysis on hierarchical surface structure and contact angle hysteresis has been put specific attention.In particular, we study the energy barrier of transition from Cassie-Baxter state to Wenzel state,based on existing achievement by previous researchers,to determine the possibility of the transition and how it can be interpreted.It has been demonstrated that surface roughness and geometry will influence the energy required for a drop to get into equilibrium,no matter it is homogeneous or heterogeneous wetting.展开更多
An orthogonal method was used to evaluate the effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solders by wetting balance method. The results show that the optimal loadi...An orthogonal method was used to evaluate the effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solders by wetting balance method. The results show that the optimal loading of Ga, Al, Ag, and Ce was 0.2 wt.%, 0.002 wt.%, 0.25 wt.%, and 0.15 wt.%, respectively. Intermetallic compounds （IMCs） formed at the interface between Sn-9Zn-0.2Ga-0.002Al-0.25Ag- 0.15Ce solder and Cu substrate were investigated by scanning electron microscope （SEM） and energy dispersive spectroscopy （EDS） analysis. The SEM images illustrate that the IMCs can be divided into two portions from the substrate side to the solder side： a planar CusZns layer and an additional continuous scallop-like AgZn3 layer. The EDS analysis also shows that Ga segregates in the solder abutting upon the interface. X-ray photoelectron spectroscopy （XPS） and Auger electron spectroscopy （AES） of the surface components of Sn-9Zn-0.2Ga-0.002Al- 0.25Ag-0.15Ce solder indicate that Al aggregates at the surface in the form of Al203 protective fdm, which prevents the further oxidation of the solder surface. On the other hand, Ce aggregates at the subsurface, which may reduce the surface tension of the solder and improve the wettability in consequence.展开更多
文摘It is well known that surface roughness has a very important effect on superhydrophobicity.The Wenzel and Cassie-Baxter models,which correspond to the homogeneous and heterogeneous wetting respectively,are currently primary instructions for designing superhydrophobic surfaces.However,the particular drop shape that a drop exhibits might depend on how it is formed. A water drop can occupy multiple equilibrium states,which relate to different local minimal energy.In some cases,both equilibrium states can even co-exist on a same substrate.Thus the apparent contact angles may vary and have different values.We discuss how the Wenzel and Cassie-Baxter equations determine the homogeneous and heterogeneous wetting theoretically. Contact angle analysis on hierarchical surface structure and contact angle hysteresis has been put specific attention.In particular, we study the energy barrier of transition from Cassie-Baxter state to Wenzel state,based on existing achievement by previous researchers,to determine the possibility of the transition and how it can be interpreted.It has been demonstrated that surface roughness and geometry will influence the energy required for a drop to get into equilibrium,no matter it is homogeneous or heterogeneous wetting.
文摘An orthogonal method was used to evaluate the effects of Ga, Al, Ag, and Ce multi-additions on the wetting characteristics of Sn-9Zn lead-free solders by wetting balance method. The results show that the optimal loading of Ga, Al, Ag, and Ce was 0.2 wt.%, 0.002 wt.%, 0.25 wt.%, and 0.15 wt.%, respectively. Intermetallic compounds （IMCs） formed at the interface between Sn-9Zn-0.2Ga-0.002Al-0.25Ag- 0.15Ce solder and Cu substrate were investigated by scanning electron microscope （SEM） and energy dispersive spectroscopy （EDS） analysis. The SEM images illustrate that the IMCs can be divided into two portions from the substrate side to the solder side： a planar CusZns layer and an additional continuous scallop-like AgZn3 layer. The EDS analysis also shows that Ga segregates in the solder abutting upon the interface. X-ray photoelectron spectroscopy （XPS） and Auger electron spectroscopy （AES） of the surface components of Sn-9Zn-0.2Ga-0.002Al- 0.25Ag-0.15Ce solder indicate that Al aggregates at the surface in the form of Al203 protective fdm, which prevents the further oxidation of the solder surface. On the other hand, Ce aggregates at the subsurface, which may reduce the surface tension of the solder and improve the wettability in consequence.
