The present research exploits diffusion brazing of mechanically alloyed Y 2O_3 dispersion strengthened nick-el-base MA760 and iron-base MA956 alloys using B-and P-containing thin foil and sputter coated interlayers.Mi...The present research exploits diffusion brazing of mechanically alloyed Y 2O_3 dispersion strengthened nick-el-base MA760 and iron-base MA956 alloys using B-and P-containing thin foil and sputter coated interlayers.Microstructures of diffission brazed interface before and after recrystallization annealing were investigated usingoptical metallography, electron microprobe analysis, and transmission electron microscopy. It has been foundthat B and P have a strons influence on the recrystallization behavior of these materials. Too high B or P levelsin the interlayers caused recrystallization of the base alloys during brazing process which was operated at temperatures below normal recrystallization points.展开更多
A simple creep testing method is presented which involves using coiled specimens. With this method, a single experiment can give all the data required for a plot of strain rate versus stress. The value of the stress-e...A simple creep testing method is presented which involves using coiled specimens. With this method, a single experiment can give all the data required for a plot of strain rate versus stress. The value of the stress-expo-nent of room temperature steady-state creep a Pb-61. 5wt %Sn solder was measured in this way to be 1. 06,aselected from a diffusion creep mechanism.展开更多
文摘The present research exploits diffusion brazing of mechanically alloyed Y 2O_3 dispersion strengthened nick-el-base MA760 and iron-base MA956 alloys using B-and P-containing thin foil and sputter coated interlayers.Microstructures of diffission brazed interface before and after recrystallization annealing were investigated usingoptical metallography, electron microprobe analysis, and transmission electron microscopy. It has been foundthat B and P have a strons influence on the recrystallization behavior of these materials. Too high B or P levelsin the interlayers caused recrystallization of the base alloys during brazing process which was operated at temperatures below normal recrystallization points.
文摘A simple creep testing method is presented which involves using coiled specimens. With this method, a single experiment can give all the data required for a plot of strain rate versus stress. The value of the stress-expo-nent of room temperature steady-state creep a Pb-61. 5wt %Sn solder was measured in this way to be 1. 06,aselected from a diffusion creep mechanism.
