Biaxial strain technology is a promising way to improve the mobility of both electrons and holes, while （100） channel direction appears as to be an effective booster of hole mobility in particular. In this work, the...Biaxial strain technology is a promising way to improve the mobility of both electrons and holes, while （100） channel direction appears as to be an effective booster of hole mobility in particular. In this work, the impact of biaxial strain together with （100） channel orientation on hole mobility is explored. The biaxial strain was incorporated by the growth of a relaxed SiGe buffer layer,serving as the template for depositing a Si layer in a state of biaxial tensile strain. The channel orientation was implemented with a 45^o rotated design in the device layout,which changed the channel direction from （110） to （100） on Si （001） surface. The maximum hole mobility is enhanced by 30% due to the change of channel direction from （110） to （100） on the same strained Si （s-Si） p-MOSFETs,in addition to the mobility enhancement of 130% when comparing s-Si pMOS to bulk Si pMOS both along （110） channels. Discussion and analysis are presented about the origin of the mobility enhancement by channel orientation along with biaxial strain in this work.展开更多
Hot carrier effects of p MOSFETs with different oxide thicknesses are studied in low gate voltage range.All electrical parameters follow a power law relationship with stress time,but degradation slope is dependent ...Hot carrier effects of p MOSFETs with different oxide thicknesses are studied in low gate voltage range.All electrical parameters follow a power law relationship with stress time,but degradation slope is dependent on gate voltage.For the devices with thicker oxides,saturated drain current degradation has a close relationship with the product of gate current and electron fluence.For small dimensional devices,saturated drain current degradation has a close relationship with the electron fluence.This degradation model is valid for p MOSFETs with 0 25μm channel length and different gate oxide thicknesses.展开更多
文摘Biaxial strain technology is a promising way to improve the mobility of both electrons and holes, while （100） channel direction appears as to be an effective booster of hole mobility in particular. In this work, the impact of biaxial strain together with （100） channel orientation on hole mobility is explored. The biaxial strain was incorporated by the growth of a relaxed SiGe buffer layer,serving as the template for depositing a Si layer in a state of biaxial tensile strain. The channel orientation was implemented with a 45^o rotated design in the device layout,which changed the channel direction from （110） to （100） on Si （001） surface. The maximum hole mobility is enhanced by 30% due to the change of channel direction from （110） to （100） on the same strained Si （s-Si） p-MOSFETs,in addition to the mobility enhancement of 130% when comparing s-Si pMOS to bulk Si pMOS both along （110） channels. Discussion and analysis are presented about the origin of the mobility enhancement by channel orientation along with biaxial strain in this work.
文摘Hot carrier effects of p MOSFETs with different oxide thicknesses are studied in low gate voltage range.All electrical parameters follow a power law relationship with stress time,but degradation slope is dependent on gate voltage.For the devices with thicker oxides,saturated drain current degradation has a close relationship with the product of gate current and electron fluence.For small dimensional devices,saturated drain current degradation has a close relationship with the electron fluence.This degradation model is valid for p MOSFETs with 0 25μm channel length and different gate oxide thicknesses.
