Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10...Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10 rain at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 rain during furnace cooling. After analyzing interface, the feasible diffusion bonding temperature was suggested as 823 K. The three major intermetallic layers generated during diffusion bonding process were identified as AIECu, AlCu＋AlaCu4 and Al4Cu9. Furthermore, local hardness values ofAlECU, AlCu＋AlaCu4 and Al4Cu9 layers average at （4.97±0.05）, （6.33±0.00） and （6.06±0.18） GPa, respectively.展开更多
基金Project (10037273) supported by the Ministry of Knowledge Economy, Korea
文摘Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10 rain at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 rain during furnace cooling. After analyzing interface, the feasible diffusion bonding temperature was suggested as 823 K. The three major intermetallic layers generated during diffusion bonding process were identified as AIECu, AlCu＋AlaCu4 and Al4Cu9. Furthermore, local hardness values ofAlECU, AlCu＋AlaCu4 and Al4Cu9 layers average at （4.97±0.05）, （6.33±0.00） and （6.06±0.18） GPa, respectively.
