The deformation, damage and failure behaviors of 17 vol.% SiCp/2009AI composite were studied by micro- scopic finite element （FE） models based on a representative volume element （RVE） and a unit cell. The RVE havi...The deformation, damage and failure behaviors of 17 vol.% SiCp/2009AI composite were studied by micro- scopic finite element （FE） models based on a representative volume element （RVE） and a unit cell. The RVE having a 3D realistic microstructure was constructed via computational modeling technique, in which an interface phase with an average thickness of 50 nm was generated for assessing the effects of interracial properties. Modeling results showed that the RVE based FE model was more accurate than the unit cell based one. Based on the RVE, the predicted stress-strain curve and the fracture morphology agreed well with the experimental results. Furthermore, lower interface strength resulted in lower flow stress and ductile damage of interface phase, thereby leading to decreased elongation. It was revealed that the stress concentration factor of SiC was -2.0： the average stress in SiC particles reached -1200 MPa, while that of the composite reached -600 MPa.展开更多
In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carrie...In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.展开更多
基金supported financially by the National Key R&D Program of China(No.2017YFB0703104)the National Natural Science Foundation of China(Nos.51671191 and 51401219)
文摘The deformation, damage and failure behaviors of 17 vol.% SiCp/2009AI composite were studied by micro- scopic finite element （FE） models based on a representative volume element （RVE） and a unit cell. The RVE having a 3D realistic microstructure was constructed via computational modeling technique, in which an interface phase with an average thickness of 50 nm was generated for assessing the effects of interracial properties. Modeling results showed that the RVE based FE model was more accurate than the unit cell based one. Based on the RVE, the predicted stress-strain curve and the fracture morphology agreed well with the experimental results. Furthermore, lower interface strength resulted in lower flow stress and ductile damage of interface phase, thereby leading to decreased elongation. It was revealed that the stress concentration factor of SiC was -2.0： the average stress in SiC particles reached -1200 MPa, while that of the composite reached -600 MPa.
文摘In this article, a new type of Cu-Ti3SiC2 composite powder prepared using the electroless plating technique was introduced. The initial Ti3SiC2 particles are 11 μm in diameter on an average. The Cu plating was carried out at middle temperature （62-65℃） with the application of ultrasonic agitation. The copper deposition rate was determined by measuring the weight gain of the powder after plating. It has been found that the pretreatment of Ti3SiC2 powder is very important to obtain copper nanoparticles on the surface of Ti3SiC2 The optimum procedure before plating aimed to add activated sites and the adjustment of the traditional composition of the electroless copper plating bath could decelerate the copper deposition rate to 0.8 gm/h. X-ray diffraction （XRD） indicates that the chemical composition of the plating layer is copper. SEM images show that the surface of the Ti3SiC2 particles is successfully coated with continuous copper layer. The wetting property between the copper matrix and Ti3SiC2 can be improved so as to increase the interfacial strength.
