High-performance Al Ga N/Ga N high electron mobility transistors（HEMTs） grown on silicon substrates by metal–organic chemical-vapor deposition（MOCVD） with a selective non-planar n-type Ga N source/drain（S/D） re...High-performance Al Ga N/Ga N high electron mobility transistors（HEMTs） grown on silicon substrates by metal–organic chemical-vapor deposition（MOCVD） with a selective non-planar n-type Ga N source/drain（S/D） regrowth are reported. A device exhibited a non-alloyed Ohmic contact resistance of 0.209 Ω·mm and a comprehensive transconductance（gm） of 247 m S/mm. The current gain cutoff frequency f T and maximum oscillation frequency f MAX of 100-nm HEMT with S/D regrowth were measured to be 65 GHz and 69 GHz. Compared with those of the standard Ga N HEMT on silicon substrate, the fTand fMAXis 50% and 52% higher, respectively.展开更多
基于0.25μm Ga N HEMT工艺,研制了一款S波段Ga N功率放大器单片微波集成电路（MMIC）。该电路采用三级拓扑放大结构,提高了放大器的增益;采用电抗匹配方式,减小了电路输出级的损耗,提高了MMIC的功率和效率。输出级有源器件的布局优化,...基于0.25μm Ga N HEMT工艺,研制了一款S波段Ga N功率放大器单片微波集成电路（MMIC）。该电路采用三级拓扑放大结构,提高了放大器的增益;采用电抗匹配方式,减小了电路输出级的损耗,提高了MMIC的功率和效率。输出级有源器件的布局优化,改善了放大器芯片的温度分布特性。测试结果表明,在2.8~3.6 GHz测试频带内,在脉冲偏压28 V（脉宽100μs,占空比10%）时,峰值输出功率大于60W,功率附加效率大于45%,小信号增益大于34 d B,增益平坦度在±0.3 d B以内,输入电压驻波比在1.7以下;在稳态偏压28 V时,连续波饱和输出功率大于40 W,功率附加效率38%以上。该MMIC尺寸为4.2 mm×4.0 mm。展开更多
The length of the transit region of a Gunn diode determines the natural frequency at which it operates in fundamental mode-the shorter the device,the higher the frequency of operation.The long-held view on Gunn diode ...The length of the transit region of a Gunn diode determines the natural frequency at which it operates in fundamental mode-the shorter the device,the higher the frequency of operation.The long-held view on Gunn diode design is that for a functioning device the minimum length of the transit region is about 1.5μm,limiting the devices to fundamental mode operation at frequencies of roughly 60 GHz.The authors posit that this theoretical restriction is a consequence of limits of the hydrodynamic models by which it was determined.Study of these devices by more advanced Monte Carlo techniques,which simulate the ballistic transport and electron-phonon interactions that govern device behaviour,offers a new lower bound of 0.5μm,which is already being approached by the experimental evidence shown in planar and vertical devices exhibiting Gunn operation at 0.6μm and 0.7μm.It is shown that the limits for Gunn domain operation are determined by the device length required for the transferred electron effect to occur(approximately 0.15μm,which as demonstrated is largely field independent)and the fundamental size of the domain(approximately 0.3μm).At this new length,operation in fundamental mode at much higher frequencies becomes possible-the Monte Carlo model used predicts power output at frequencies over 300 GHz.展开更多
Using first-principles calculations,we explored all the 21 defect-pairs in GaN and considered 6 configurations with different defect-defect distances for each defect-pair.15 defect-pairs with short defect–defect dist...Using first-principles calculations,we explored all the 21 defect-pairs in GaN and considered 6 configurations with different defect-defect distances for each defect-pair.15 defect-pairs with short defect–defect distances are found to be stable during structural relaxation,so they can exist in the GaN lattice once formed during the irradiation of high-energy particles.9 defect-pairs have formation energies lower than 10 eV in the neutral state.The vacancy-pair VN–VN is found to have very low formation energies,as low as 0 eV in p-type and Ga-rich GaN,and act as efficient donors producing two deep donor levels,which can limit the p-type doping and minority carrier lifetime in GaN.VN–VN has been overlooked in the previous study of defects in GaN.Most of these defect-pairs act as donors and produce a large number of defect levels in the band gap.Their formation energies and concentrations are sensitive to the chemical potentials of Ga and N,so their influences on the electrical and optical properties of Ga-rich and N-rich GaN after irradiation should differ significantly.These results about the defect-pairs provide fundamental data for understanding the radiation damage mechanism in GaN and simulating the defect formation and diffusion behavior under irradiation.展开更多
利用wx AMPS软件研究了I层对PIN型In Ga N太阳电池性能的影响及物理机制.通过模拟计算发现,在同质结的PIN型In Ga N太阳电池中,随着I层厚度的增加,In Ga N电池的开路电压几乎恒定,而短路电流增加,因此太阳能转换效率增加.在异质结的PIN...利用wx AMPS软件研究了I层对PIN型In Ga N太阳电池性能的影响及物理机制.通过模拟计算发现,在同质结的PIN型In Ga N太阳电池中,随着I层厚度的增加,In Ga N电池的开路电压几乎恒定,而短路电流增加,因此太阳能转换效率增加.在异质结的PIN型In Ga N太阳电池中,I层与P层和N层的In组分之差变大,会使异质结带阶变大,降低了太阳电池的能量转换效率.研究结果表明,适当选择I层厚度和In组分可以实现太阳电池转换效率提升和成本控制.展开更多
随着中转母线变换器(intermediate bus converter,IBC)的发展,其对输出功率和高开关频率的需求不断提高,而氮化镓器件的出现使得变换器的功率密度有了进一步提高的可能。该文分析了氮化镓器件的高频特性和高频工作下的优势,针对现有氮...随着中转母线变换器(intermediate bus converter,IBC)的发展,其对输出功率和高开关频率的需求不断提高,而氮化镓器件的出现使得变换器的功率密度有了进一步提高的可能。该文分析了氮化镓器件的高频特性和高频工作下的优势,针对现有氮化镓器件驱动设计困难和载流能力差的问题,设计了驱动电路关键参数和驱动回路布局,提出了基于效率优化的LLC直流变压器死区时间和分流支路数的最优解,并优化设计了变压器的结构以减小涡流损耗和漏感感值。最后制作了基于氮化镓器件的300 W、1 MHz的LLC-DCT样机,验证了设计手段的合理性和正确性。展开更多
首先介绍了LLC谐振变换器的工作原理,详细分析了基于增强型氮化镓(e Ga N)场效应晶体管的LLC谐振变换器的开关过程。分析结果表明,通过调节死区时间可以避免Ga N晶体管的反向导通,从而减小损耗;通过减小高频功率回路电感可以减小功率回...首先介绍了LLC谐振变换器的工作原理,详细分析了基于增强型氮化镓(e Ga N)场效应晶体管的LLC谐振变换器的开关过程。分析结果表明,通过调节死区时间可以避免Ga N晶体管的反向导通,从而减小损耗;通过减小高频功率回路电感可以减小功率回路的振荡。再对死区时间和功率回路布线分别进行了优化,由于Ga N晶体管栅源电压安全裕量很小,为确保器件安全,对驱动回路布线进行优化;最后设计了1台输入电压为48 V、输出电压为12 V、输出功率为100 W、开关频率为1 MHz的LLC实验样机,并进行了实验验证。实验结果表明,高频功率回路电感从5.6 n H降为0.4 n H时,下管关断时的漏源电压超调由15%下降到6.7%,另外驱动功率回路采用单层布线带屏蔽层的布线方式后,开关管的驱动电压几乎没有振荡。展开更多
利用具备亚微米量级空间分辨率和纳秒级时间分辨率的热反射测温技术对工作在脉冲偏置条件下的CGH4006P型Ga N HEMT进行了瞬态温度检测。测量了Ga N器件表面栅极、漏极和源极金属各部位在20μs内的瞬态温度幅度、分布及变化速度等数据。...利用具备亚微米量级空间分辨率和纳秒级时间分辨率的热反射测温技术对工作在脉冲偏置条件下的CGH4006P型Ga N HEMT进行了瞬态温度检测。测量了Ga N器件表面栅极、漏极和源极金属各部位在20μs内的瞬态温度幅度、分布及变化速度等数据。栅极、漏极和源极的温度幅度有着非常明显的差距,器件表面以栅为中心呈现较大的温度分布梯度。器件表面栅金属温度变化幅度最高、变化速度最快,其主要温度变化发生在5μs之内。经过仔细分析,器件各部位温度差异的主要原因是器件的传热方向、不同区域与发热点的距离。展开更多
逆F类功放在接近饱和区工作时效率很高,将其与Doherty功放结构相结合,可以实现一种在大功率回退的情况下仍然具有很高效率的射频功率放大器。本文设计了一款基于Ga N HEMT晶体管的高效率的逆F类Doherty功率放大器,工作频带为910MHz^950...逆F类功放在接近饱和区工作时效率很高,将其与Doherty功放结构相结合,可以实现一种在大功率回退的情况下仍然具有很高效率的射频功率放大器。本文设计了一款基于Ga N HEMT晶体管的高效率的逆F类Doherty功率放大器,工作频带为910MHz^950MHz。单音信号测试结果显示,在930MHz处,功放回退7.5d B后漏极效率仍高达64.2%。使用3载波WCDMA信号作为测试信号,利用数字预失真技术进行线性化后,功放输出信号的上下边带邻信道功率比(ACPR)分别为-35.39d Bc和-35.9d Bc。展开更多
基金Project supported by the Young Scientists Fund of the National Natural Science Foundation of China(Grant No.61401373)the Fundamental Research Funds for Central Universities,China(Grant No.XDJK2013B004)the Research Fund for the Doctoral Program of Southwest University,China(Grant No.SWU111030)
文摘High-performance Al Ga N/Ga N high electron mobility transistors（HEMTs） grown on silicon substrates by metal–organic chemical-vapor deposition（MOCVD） with a selective non-planar n-type Ga N source/drain（S/D） regrowth are reported. A device exhibited a non-alloyed Ohmic contact resistance of 0.209 Ω·mm and a comprehensive transconductance（gm） of 247 m S/mm. The current gain cutoff frequency f T and maximum oscillation frequency f MAX of 100-nm HEMT with S/D regrowth were measured to be 65 GHz and 69 GHz. Compared with those of the standard Ga N HEMT on silicon substrate, the fTand fMAXis 50% and 52% higher, respectively.
文摘基于0.25μm Ga N HEMT工艺,研制了一款S波段Ga N功率放大器单片微波集成电路（MMIC）。该电路采用三级拓扑放大结构,提高了放大器的增益;采用电抗匹配方式,减小了电路输出级的损耗,提高了MMIC的功率和效率。输出级有源器件的布局优化,改善了放大器芯片的温度分布特性。测试结果表明,在2.8~3.6 GHz测试频带内,在脉冲偏压28 V（脉宽100μs,占空比10%）时,峰值输出功率大于60W,功率附加效率大于45%,小信号增益大于34 d B,增益平坦度在±0.3 d B以内,输入电压驻波比在1.7以下;在稳态偏压28 V时,连续波饱和输出功率大于40 W,功率附加效率38%以上。该MMIC尺寸为4.2 mm×4.0 mm。
文摘The length of the transit region of a Gunn diode determines the natural frequency at which it operates in fundamental mode-the shorter the device,the higher the frequency of operation.The long-held view on Gunn diode design is that for a functioning device the minimum length of the transit region is about 1.5μm,limiting the devices to fundamental mode operation at frequencies of roughly 60 GHz.The authors posit that this theoretical restriction is a consequence of limits of the hydrodynamic models by which it was determined.Study of these devices by more advanced Monte Carlo techniques,which simulate the ballistic transport and electron-phonon interactions that govern device behaviour,offers a new lower bound of 0.5μm,which is already being approached by the experimental evidence shown in planar and vertical devices exhibiting Gunn operation at 0.6μm and 0.7μm.It is shown that the limits for Gunn domain operation are determined by the device length required for the transferred electron effect to occur(approximately 0.15μm,which as demonstrated is largely field independent)and the fundamental size of the domain(approximately 0.3μm).At this new length,operation in fundamental mode at much higher frequencies becomes possible-the Monte Carlo model used predicts power output at frequencies over 300 GHz.
基金supported by the Science Challenge Project (TZ2018004)National Natural Science Foundation of China (NSFC) under grant Nos. 61722402 and 91833302+3 种基金National Key Research and Development Program of China (2016YFB0700700)Shanghai Academic/Technology Research Leader (19XD1421300)Fok Ying Tung Education Foundation (161060)the Fundamental Research Funds for the Central Universities
文摘Using first-principles calculations,we explored all the 21 defect-pairs in GaN and considered 6 configurations with different defect-defect distances for each defect-pair.15 defect-pairs with short defect–defect distances are found to be stable during structural relaxation,so they can exist in the GaN lattice once formed during the irradiation of high-energy particles.9 defect-pairs have formation energies lower than 10 eV in the neutral state.The vacancy-pair VN–VN is found to have very low formation energies,as low as 0 eV in p-type and Ga-rich GaN,and act as efficient donors producing two deep donor levels,which can limit the p-type doping and minority carrier lifetime in GaN.VN–VN has been overlooked in the previous study of defects in GaN.Most of these defect-pairs act as donors and produce a large number of defect levels in the band gap.Their formation energies and concentrations are sensitive to the chemical potentials of Ga and N,so their influences on the electrical and optical properties of Ga-rich and N-rich GaN after irradiation should differ significantly.These results about the defect-pairs provide fundamental data for understanding the radiation damage mechanism in GaN and simulating the defect formation and diffusion behavior under irradiation.
文摘利用wx AMPS软件研究了I层对PIN型In Ga N太阳电池性能的影响及物理机制.通过模拟计算发现,在同质结的PIN型In Ga N太阳电池中,随着I层厚度的增加,In Ga N电池的开路电压几乎恒定,而短路电流增加,因此太阳能转换效率增加.在异质结的PIN型In Ga N太阳电池中,I层与P层和N层的In组分之差变大,会使异质结带阶变大,降低了太阳电池的能量转换效率.研究结果表明,适当选择I层厚度和In组分可以实现太阳电池转换效率提升和成本控制.
文摘随着中转母线变换器(intermediate bus converter,IBC)的发展,其对输出功率和高开关频率的需求不断提高,而氮化镓器件的出现使得变换器的功率密度有了进一步提高的可能。该文分析了氮化镓器件的高频特性和高频工作下的优势,针对现有氮化镓器件驱动设计困难和载流能力差的问题,设计了驱动电路关键参数和驱动回路布局,提出了基于效率优化的LLC直流变压器死区时间和分流支路数的最优解,并优化设计了变压器的结构以减小涡流损耗和漏感感值。最后制作了基于氮化镓器件的300 W、1 MHz的LLC-DCT样机,验证了设计手段的合理性和正确性。
文摘首先介绍了LLC谐振变换器的工作原理,详细分析了基于增强型氮化镓(e Ga N)场效应晶体管的LLC谐振变换器的开关过程。分析结果表明,通过调节死区时间可以避免Ga N晶体管的反向导通,从而减小损耗;通过减小高频功率回路电感可以减小功率回路的振荡。再对死区时间和功率回路布线分别进行了优化,由于Ga N晶体管栅源电压安全裕量很小,为确保器件安全,对驱动回路布线进行优化;最后设计了1台输入电压为48 V、输出电压为12 V、输出功率为100 W、开关频率为1 MHz的LLC实验样机,并进行了实验验证。实验结果表明,高频功率回路电感从5.6 n H降为0.4 n H时,下管关断时的漏源电压超调由15%下降到6.7%,另外驱动功率回路采用单层布线带屏蔽层的布线方式后,开关管的驱动电压几乎没有振荡。
文摘利用具备亚微米量级空间分辨率和纳秒级时间分辨率的热反射测温技术对工作在脉冲偏置条件下的CGH4006P型Ga N HEMT进行了瞬态温度检测。测量了Ga N器件表面栅极、漏极和源极金属各部位在20μs内的瞬态温度幅度、分布及变化速度等数据。栅极、漏极和源极的温度幅度有着非常明显的差距,器件表面以栅为中心呈现较大的温度分布梯度。器件表面栅金属温度变化幅度最高、变化速度最快,其主要温度变化发生在5μs之内。经过仔细分析,器件各部位温度差异的主要原因是器件的传热方向、不同区域与发热点的距离。
文摘基于Ga N微波功率器件工艺制作了大栅宽Ga N高电子迁移率晶体管（HEMT）管芯,通过负载牵引及建模技术提取了管芯的输入阻抗、输出阻抗。采用二项式多节阻抗匹配变换器实现了宽带功率分配器及合成器电路的制作,通过采用LC网络提升了管芯输入阻抗、输出阻抗,加入了稳定网络,实现了50Ω阻抗匹配。采用高热导率金属陶瓷外壳,提高了器件散热能力。最终研制成功大功率Ga N HEMT内匹配器件,器件采用四胞管芯功率合成技术,总栅宽为40 mm。测试结果表明,频率为4.5~4.8 GHz,脉宽300μs,占空比10%,工作电压VDS为28V,器件的输出功率大于120 W,功率附加效率大于50%,功率增益大于11 d B。
