针对调幅式电容位移传感器乘法器检波存在的速度慢、功耗大和热噪声大问题,设计了一种基于模拟开关的全波检波电路。首先,对开关全波检波和开关半波检波原理进行分析,根据分析结果选择了全波检波方法。在此基础上,完成开关全波检波电路...针对调幅式电容位移传感器乘法器检波存在的速度慢、功耗大和热噪声大问题,设计了一种基于模拟开关的全波检波电路。首先,对开关全波检波和开关半波检波原理进行分析,根据分析结果选择了全波检波方法。在此基础上,完成开关全波检波电路设计与测量系统其它部分设计。最后,利用八位半数字表3458A对检波电路与测量系统性能指标进行测试。测试结果表明：检波电路可以实现0.1 m V的分辨率,测量系统在150~650μm范围内分辨率达30 nm,系统示值稳定性0.1 m V/30 min,电容测量系统最大测量偏差为20 nm。该测量系统满足电容测微系统稳定性好、准确性高的要求。展开更多
This study presents an improvement of high dynamic range contact-type capacitive displacement sensor by applying planarization. The sensor is called the contact-type linear encoder-like capacitive displacement sensor ...This study presents an improvement of high dynamic range contact-type capacitive displacement sensor by applying planarization. The sensor is called the contact-type linear encoder-like capacitive displacement sensor (CLECDiS), is a nano-meter-resolution sensor with a wide dynamic range. However, height differences due to patterned electrodes may cause a variety of problems or performance degradation. In devices of two glass wafer surfaces with patterned structures assembled face-to-face and in sliding contact, the heights of the patterns crucially affect their performance and practicality, so it should be planarized for reducing the problem. A number of techniques for planarizing glass wafer surfaces with patterned chrome electrodes were evaluated and the following three were selected as adequate: lift-off, etch-back, and chemical mechanical polishing (CMP). The fabricated samples showed that CMP provided the best planarization. CMP was successfully employed to produce CLECDiS with improved signal reliability due to reduced collisions between electrodes.展开更多
文摘针对调幅式电容位移传感器乘法器检波存在的速度慢、功耗大和热噪声大问题,设计了一种基于模拟开关的全波检波电路。首先,对开关全波检波和开关半波检波原理进行分析,根据分析结果选择了全波检波方法。在此基础上,完成开关全波检波电路设计与测量系统其它部分设计。最后,利用八位半数字表3458A对检波电路与测量系统性能指标进行测试。测试结果表明：检波电路可以实现0.1 m V的分辨率,测量系统在150~650μm范围内分辨率达30 nm,系统示值稳定性0.1 m V/30 min,电容测量系统最大测量偏差为20 nm。该测量系统满足电容测微系统稳定性好、准确性高的要求。
文摘This study presents an improvement of high dynamic range contact-type capacitive displacement sensor by applying planarization. The sensor is called the contact-type linear encoder-like capacitive displacement sensor (CLECDiS), is a nano-meter-resolution sensor with a wide dynamic range. However, height differences due to patterned electrodes may cause a variety of problems or performance degradation. In devices of two glass wafer surfaces with patterned structures assembled face-to-face and in sliding contact, the heights of the patterns crucially affect their performance and practicality, so it should be planarized for reducing the problem. A number of techniques for planarizing glass wafer surfaces with patterned chrome electrodes were evaluated and the following three were selected as adequate: lift-off, etch-back, and chemical mechanical polishing (CMP). The fabricated samples showed that CMP provided the best planarization. CMP was successfully employed to produce CLECDiS with improved signal reliability due to reduced collisions between electrodes.
