摘要
本文分析导轨式电源外壳的结构特点,应用Moldflow软件对导轨式电源外壳注塑成型过程进行模拟仿真分析,设置最佳浇口位置,并对塑件的填充时间、流动前沿温度、气穴、翘曲变形进行模拟分析,为模具设计提供合理的方案和工艺参数。
The paper analyzes the technology characteristics of DIN-rail power supply housing. Moldflow software is used to simulate the injection process, setting up the optimal injection gate, filling time, temperature at flow front result, cavitation and warpage deformation, based on simulation result, to figure out the feasible tooling design and injection parameters.
出处
《机械工程与技术》
2017年第2期169-178,共10页
Mechanical Engineering and Technology
