摘要
基于双π型电磁干扰滤波器(EMIF)的电路结构,借鉴集成电路超微细加工技术,提出了与等平面超大规模集成电路工艺完全兼容的一种新型三维集成射频干扰滤波器电路;简要介绍了该电路的绝缘层上金属薄膜三维集成制造方法,建立了电路传递函数模型,并进行了简要分析。该电路可用于制作适合未来电子系统高频化、小型化、轻型化和片式化信号处理的RF片上系统。
A novel radio frequency interference filter (RFIF) completely compatible with VLSI technology was presented, which was based on a double-π-type EMIF structure and micro-fabrication technology for iso-planar VLSI's.The manufacturing method for the 3-D integrated radio frequency interference filter circuit with metal film on insulator is briefly described.A transfer function model for the 3-DIRFIF is derived and analyzed.The circuit can be used in RF SOC's for signal processing of miniaturized and lightweight, high-frequency electronic systems.
出处
《微电子学》
CAS
CSCD
北大核心
2004年第1期60-62,共3页
Microelectronics
基金
国家自然科学基金资助项目(60171033)
