摘要
Two-dimensional(2D) materials, such as graphene, transition metal dichalcogenides(TMDs), black phosphorus(BP),and related derivatives, have attracted great attention due to their advantages of flexibility, strong light–matter interaction,broadband absorption, and high carrier mobility, and have become a powerful contender for next-generation infrared photodetectors. However, since the thickness of 2D materials is on the order of nanometers, the absorption of 2D materials is very weak, which limits the detection performance of 2D materials-based infrared photodetectors. In order to solve this problem, scientific researchers have tried to use optimized device structures to combine with 2D materials for improving the performance of infrared photodetectors. In this review, we review the progress of room-temperature infrared photodetectors with hybrid structure based on 2D materials in recent years, focusing mainly on 2D–nD(n = 0, 1, 2) heterostructures, the integration between 2D materials and on-chip or plasmonic structure. Finally, we summarize the current challenges and point out the future development direction.
Two-dimensional(2D) materials, such as graphene, transition metal dichalcogenides(TMDs), black phosphorus(BP),and related derivatives, have attracted great attention due to their advantages of flexibility, strong light–matter interaction,broadband absorption, and high carrier mobility, and have become a powerful contender for next-generation infrared photodetectors. However, since the thickness of 2D materials is on the order of nanometers, the absorption of 2D materials is very weak, which limits the detection performance of 2D materials-based infrared photodetectors. In order to solve this problem, scientific researchers have tried to use optimized device structures to combine with 2D materials for improving the performance of infrared photodetectors. In this review, we review the progress of room-temperature infrared photodetectors with hybrid structure based on 2D materials in recent years, focusing mainly on 2D–nD(n = 0, 1, 2) heterostructures, the integration between 2D materials and on-chip or plasmonic structure. Finally, we summarize the current challenges and point out the future development direction.
基金
Project supported by the National Natural Science Foundation of China(Grant No.61704061)
