摘要
采用聚合物前驱体法制备了CeO2-CuO—doped SnO2纳米粉体,并研究了掺杂SnO2纳米粉体的无压烧结行为.结果表明:乙二醇、柠檬酸与金属离子的摩尔比为6∶3∶1时制得的掺杂SnO2粉体为分散良好的球形颗粒,大小为～15nm,粒度分布范围窄;CuO掺杂可显著提高SnO2的烧结性能, CeO2-CuO复合掺杂可进一步降低SnO2陶瓷的致密化温度;1.O％CeO2-1.5％CuO-doped SnO2可在1050℃烧结致密,相对密度达96％以上;两步法(先升温到1050℃保温15min,然后降到980℃烧结5h)烧结的1.O％CeO2-1.5％CuO-doped SnO2陶瓷相对密度为96.1％,其晶粒<800nm.
Nanocrystalline SnO2 powders doped with CeO2 and CuO were prepared by the polymeric precursors method. XRD, TG-DSC, TEM and SEM techniques were used to characterize the as-prepared powders and the sintered compacts. The molar ratios of citric acid to metallic elements and ethylene glycol to citric acid were 3:1 and 2:1, respectively. The precursors after burning were calcined at 550degreesC in air, and spherical, well-dispersed doped SnO2 powders with an average diameter of similar to15nm were obtained. The relative density of 1.0%CeO2-1.5%CuO-doped SnO2 ceramics sintered at 1050degreesC is over 96%; the 1.5%CuO-doped SnO2 ceramics can be densified at 1100degreesC. The grain size of the 1.0%CeO2-1.5%CuO-doped SnO2 ceramics densified by two-step sintering (first at 1050degreesC for 15min, then cooling down to 980degreesC and holding for 5h) is smaller than 800nm.
出处
《无机材料学报》
SCIE
EI
CAS
CSCD
北大核心
2004年第1期58-62,共5页
Journal of Inorganic Materials
