摘要
电镀制作过程中,为提升电镀能力T/P值,往往通过调整药水、电镀设备等手段进而改善电镀深镀能力。文章主要通过实验和过程确认,验证电镀震动在PCB电镀过程品质的影响,震动幅度大小对深度能力的影响,并深入介绍振幅的检测方法、日常检查和监控等。
In the process of electroplating, the capability of electroplating T/P value is improved by adjusting potions and electroplating equipment. Mainly through the experiment and the process confirmation, this article verifies the effect of electroplating vibration on the quality of PCB electroplating process, the influence of vibration amplitude on depth capability, and thoroughly introduces Amplitude detection methods, daily inspection andmonitoring, etc.
作者
王佐
王敏
李清春
郭宇
黄慧
Wang Zuo;Wang Min;Li Qingchun;Guo Yu;Huang Hui
出处
《印制电路信息》
2019年第3期19-22,共4页
Printed Circuit Information
关键词
震动幅度
深镀能力
孔无铜
Vibration
Amplitude
D/P
Capability
Plating Voids
