摘要
Surface peeling of Cu-Fe-P lead frame alloy was analyzed using plane strain model and elastoplastic finite element method. Based on the characterization of microstructure at surface peeling in finish rolled Cu-Fe-P lead frame alloy, the stress and strain distributions of the interface between Cu matrix and Fe particle are studied. Results indicate that the equivalent strain mismatch 6.9% between Cu matrix and Fe particle and the intense stress concentration at the interface have influence on surface peeling generation. The crack is prone to the electrical conductivity decreasing of Cu-Fe-P alloy and surface peeling on finish rolling.
Surface peeling of Cu-Fe-P lead frame alloy was analyzed using plane strain model and elastoplastic finite element method. Based on the characterization of microstructure at surface peeling in finish rolled Cu-Fe-P lead frame alloy, the stress and strain distributions of the interface between Cu matrix and Fe particle are studied. Results indicate that the equivalent strain mismatch 6.9% between Cu matrix and Fe particle and the intense stress concentration at the interface have influence on surface peeling generation. The crack is prone to the electrical conductivity decreasing of Cu-Fe-P alloy and surface peeling on finish rolling.
基金
theState"863Plan" (2 0 0 2AA3 3 1112 )andDoctorateFoundationofNorthwesternPolytechnicalUniversity
