摘要
用3D-C/SiC和重结晶SiC陶瓷材料在光辐射热震试验机上进行了两种温度落差(ΔΤ=600℃,800℃)和不同应力的热震试验。3D-C/SiC用弹性模量和电阻表征的热震损伤曲线有相似的规律,即都大致由三阶段构成,首先是损伤急剧增加阶段,紧接着是损伤缓慢增加阶段,最后为损伤短暂的急剧增加阶段。个别电阻表征的热震损伤曲线仅在初始阶段损伤有下降现象。3D-C/SiC复合材料的抗热震性能明显优于重结晶SiC陶瓷材料;三种界面层的3D-C/SiC中,以热解碳沉积时间为20h获得的界面层复合材料热震寿命最长。
Thermal shock behavior of 3D-C/SiC and recrystallization of SiC were investigated under two temperature drops(ΔΤ=600℃,800℃)and different stress in light-radiation thermal shock testing machine. The results indicate that thermal shock curve evaluated by Young′s modulus was similar to that by electrical resistance, and they approximately consisted of three stages, that is the rapid damage stage, the stable damage stage, and then the damage sharply accelerated stage. However, exceptional thermal shock curve expressed by electrical resistance only occurred to drop in the initial stage. Moreover, thermal shock behavior of 3D-C/SiC was distinctly superior to that of recrystallization of SiC, and when the deposition time of pyrocarbon was 20h, 3D-C/SiC possessed the longest thermal shock life.
出处
《材料工程》
EI
CAS
CSCD
北大核心
2003年第12期26-28,共3页
Journal of Materials Engineering
