摘要
研究了温度循环对半导体集成电路气密性的影响,阐述了影响集成电路管壳气密性的各种因素;提出了一种摸底试验的方法;对5种集成电路管壳进行了温度循环试验,并对试验结果进行了分析。就试验的几种外壳来看,至少可以经受1000次温度循环,其气密性仍然满足要求。
Effects of temperature cycling on the airtightness of semiconductor IC's are investigated in the paper Factors causing airtightness defects in IC's are described A method for simulation test is presented Temperature cycling tests are performed, and the results are analyzed It has been shown that, for the IC packages tested, the airtightness still meets the requirement after 1000 temperature cycles
出处
《微电子学》
CAS
CSCD
北大核心
2003年第5期425-427,共3页
Microelectronics
