摘要
简要介绍了X射线无损检测技术的现状和发展趋势,介绍了X射线焊点无损检测机理,重点对基于2D图像的X射线检测和基于2D图像,具有OVHM(最高放大倍数的倾斜视图)的X射线检测以及3DX射线检测三种方法进行了比较分析,推荐出各类检测技术适应范围。
Introduce the situation and development of X-ray inspection technique for PCB solder joints.Describe the principle of operation of 2D X-ray,2D X-ray with OVHM (oblique view at highest magnification) and 3D X-Ray inspection.Make a comparison among their performance,analyze and put forward the use fields of them individually.
出处
《电子工艺技术》
2003年第5期189-191,共3页
Electronics Process Technology
关键词
印制组件焊点
X射线
检测技术
PCB solder joints
2D X-Ray
2D X-Ray with OVHM
3D X-Ray inspection technique
