摘要
研究表明:EAF-CSP工艺热轧薄板中Cu的偏聚是产生表面微裂纹及边裂的主要原因,控制钢中铜和低熔点元素的总量,调整薄板坯均热温度和时间,可以减少表面微裂纹与边裂;透射电镜观察到纳米尺寸的硫化铜沉淀。讨论了Cu对CSP工艺热轧薄板质量的影响。
Effect of Cu segregation on surface flaws of CSP hot strips has been studied. Based on the Copper segregation equilibrium, it is concluded that the surface flaws can be reduced by controlling the content of Cu in liquid steel, and the content of other elements of low melting point. Increasing the soaking temperature is also helpful. The Copper sulfide precipitates in nanometers size. Influence of Cu on quality of the CSP hot strips is discussed.
出处
《钢铁》
CAS
CSCD
北大核心
2003年第8期43-46,共4页
Iron and Steel
