摘要
通过轧制复合方法,在不同温度条件下制备了Ag/Cu双金属板,研究了剥离载荷作用下分离强度与复合温度的关系,测定了复合基体的硬度并观察了分离界面形貌。结果表明:350℃复合的试样因具有较大面积的异种金属冶金结合区域而导致其分离强度较高;低于350℃复合试样的冶金结合区域减少,高于350℃复合试样的金属表面趋向于被连续分布的氧化物隔离,这两种情况均会使分离强度下降。
The Ag/Cu bimetallic strips were prepared by roll bonding at different temperatures. The effecs of roll temperature on the bonding strength under the condition of peeling load were investigated. The hardness of the strip matrixes was determined and the morphology of the peeling surfaces was observed. The large connecting area by the metallurgical reaction on the peeling surfaces of the laminated strips bonded at 350℃ results in a high bonding strength. The connected area by the metallurgical reaction decreases when the strips are bonded at the temperature lower than 350℃. The metallic surface is seperated by the oxide layer between Ag and Cu when the strips are bonded at the temperature higher than 350℃, decreasing the bonding strength in both cases.
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2003年第7期530-533,共4页
Rare Metal Materials and Engineering
基金
云南省省校科技合作基金资助项目(98YZ-002)
