摘要
叙述了先进再流焊接技术的新发展,描述了提高BGA再流焊接效果的工艺要点,优化倒装芯片再流焊接和固化的新方法。最后,讲述了先进的降低氮消耗量的方法即:通过最大限度地提高潜在收益,以促进再流焊接技术的发展,以此来满足装配厂商的需要。
Advanced packages require sophisticated reflow techniques such as nitro gen in erting and forced convection.This article reviews these new developments,first out lin ing pro cess re fine-ments to enhance BGA reflow,then describing new methods to opti mize flip chip re flow and cur ing.Finally,and the advantages of reducing nitro gen con sump tion-the re flow ad vance with the most significant poten tial benefit for assem blers are reviewed.
出处
《电子工业专用设备》
2003年第3期83-86,共4页
Equipment for Electronic Products Manufacturing
关键词
再流焊接
氮气氛
球棚阵列(BGA)
Reflow Soldering
Nitrogen Atmosphere
Ball Grid Array(BGA)
