FPD MARKET ANALYSIS 2002:LCoS步履艰难
-
1陶伟.CDMA在中国市场步履艰难[J].电子质量,1998(5):43-44.
-
2Zhang Kai (Mobile Division of ZTE Corporation,Shanghai 201203,China).GSM-WLL Technology and Its Market Analysis[J].ZTE Communications,2004,2(1):43-44.
-
3侯自强.从网络电视台开播看三网融合[J].通信世界,2010(2):33-33.
-
4STE50D100:混合发射极晶体管[J].世界电子元器件,2005(2):90-90.
-
5汽车电子[J].汽车制造业,2007(F12):70-70.
-
6苏俊斌.整体转换,为何步履艰难?[J].中国数字电视,2007(9):62-64.
-
7叶祖超,陆荣.密闭热系统中拉制硅单晶[J].上海有色金属,1998,19(3):102-105.
-
8Frost&Sullivan.ZTE to Become Top 3 Global GSM Vendor in Newly Added Markets in 2009[J].ZTE Communications,2009,7(3):68-68.
-
9内蒙可以生产14~18in P<100>半导体级大直径硅单晶[J].光机电信息,2009,26(4):57-57.
-
10杨建平.德国HUMAX HDCI-2000双CI高清插卡机(下)[J].卫星电视与宽带多媒体,2007(10):42-45.