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用于热防护材料的低温固化有机硅-环氧接枝树脂体系 被引量:1

Low Temperature Curing Silicone-Epoxy Resin Used as Heat Protective Material
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摘要 对有机硅-环氧接枝系列树脂进行低温固化条件试验,筛选出固化促进剂,它不仅改变该树脂交联结构、热降解结果,提高交联密度、表面硬度,而且改善该树脂的热性能和烧蚀性能、实现低温固化。该树脂可作涂料及复合材料等基体树脂,用作火箭发动机等的热防护材料。 Low temperature curing tests were performed on silicone-epoxy series resins for screening ofcuring accelerators, which not only changed the crosslinking structure and heat degradationof the resins, incrased their crosslinking density and surface hardness, but also improvedthe thermal and ablative properties of the resins, and effected low temperature curing. Suchresins may be used as base resins of coating and composite materials for heat protectivematerials of rocket engines, etc.
出处 《合成树脂及塑料》 CAS 1992年第3期32-35,共4页 China Synthetic Resin and Plastics
关键词 热防护 促进剂 有机硅 环氧树脂 Ablator Low temperature curing Accelerator, Silicone-epoxy resin
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