摘要
介绍了国际和国内半导体封装业的发展情况及几种新颖封装,指出中国即将成为国际半导体封装产业的重要基地之一,这为我国发展半导体封装设备提供了良好的市场前景,例举了有关半导体封装工艺、检测、试验及支撑所需的设备。
This paper briefly introduces the development of international and domestic semiconductor devices packaging industry, and presents that China will become one of the important base of international semiconductor devices packaging. This will provide good prospects in market for development of semiconductor devices packaging equipments in China. This paper also introduces the main packaging equipments.
出处
《电子工业专用设备》
2003年第1期7-11,共5页
Equipment for Electronic Products Manufacturing
