摘要
采用复合电铸工艺制备碳化硅颗粒 (Si Cp)增强铜基复合材料 ,重点研究了添加剂、颗粒粒径、电流密度、施镀温度、搅拌强度等工艺参数对 Cu/ Si Cp 复合材料中 Si Cp 含量的影响 .结果表明 ,优化各工艺参数可有效促进 Si Cp 与铜离子的共沉积 ,提高复合材料中增强固体颗粒的含量 .在此基础上研究开发了一种可有效促进 Si C颗粒与铜共沉积的混合添加剂 ,可获得 Si Cp 含量较高的Cu/ Si Cp复合材料 .
The composite electroforming technology was propounded to fabricate SiC particle reinforced copper composite. The influence of additive, diameter of SiC particle, current density, electroforming temperature, strength of mix round on the SiCp composite was studied. The result indicates that through optimizing the technology parameter, it can promote co-sediment of Cu and SiC particle effectively and enhance the volume percentage of SiC particle in composites. Based on the research, a mixed additive which can make Cu/SiCp composite with high content of SiCp was found.
出处
《上海交通大学学报》
EI
CAS
CSCD
北大核心
2003年第2期182-185,共4页
Journal of Shanghai Jiaotong University
基金
国家高技术研究发展计划 ( 86 3)项目 ( 2 0 0 2 AA334 0 1 0 )
上海应用材料研究与发展基金资助项目 ( 980 6 )
关键词
复合电铸
铜基
碳化硅颗粒
复合材料
Composite materials
Copper
Fabrication
Silicon carbide
