摘要
为掌握铜与陶瓷内套封结构的钎焊工艺,以套封长度20 mm的铜柱和陶瓷套的内套封结构为研究对象,选用Ag72Cu丝状钎料,采用Mo-Mn金属化法和真空钎焊工艺,开展了钎焊试验。针对套封结构的组装间隙开展了试验研究,通过破坏性试验和金相观察,分析了内套封结构的外观成型,钎料填缝性能和接头界面组织。结果表明,制定的组装方案定位容易,装配难度小。在拟定工艺下施焊,钎料填满整条焊缝,钎缝结合良好。0.3~0.4 mm的组装间隙能较好的保证钎焊质量。间隙较大时,界面迁移扩散明显。
In order to master ceramic-to-copper sleeve seal brazing process,the article focused on 20 mm length of ceramic-to-copper sleeve seal structure,72 AgCu in wire shape was chose to be the filler metal,the sleeve seal joint was produced by activated molybdenummanganese and vacuum brazing route. Influences of assembling gap on ceramic-to-copper sleeve seal experiment was studied,sealing performance and metallic phase was analyzed. The results show that the sleeve seal is high quality and the filler fill full of the joint. The best assembling gap is 0. 3-0. 4 mm. Interface migration diffuse is obvious on the condition of large gap.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2015年第S1期27-31,共5页
Transactions of Materials and Heat Treatment
关键词
铜和陶瓷
套封
钎焊
组装间隙
ceramic-to-copper
sleeve seal
braze
assembling gap
