摘要
近年来随着微电子工业的发展,要求发展超薄耐热聚合物薄膜,尤其是聚酰亚胺(PI)超薄薄膜.L-B法能制造超薄PI薄膜.本文叙述了L-B法的发展,并介超了PI耐热聚合物的制法.
Microelectronics need superthin film of heat resistant polymers, particularly PI superthin film. Superthin film may be made by L-B method. This article describes new development for L-B method, and the manufacture of PI and heat resistant polymers.
出处
《高分子通报》
CAS
CSCD
1992年第1期46-51,共6页
Polymer Bulletin
关键词
超薄薄膜
耐热聚合物
L-B法
L-B method
Superthin film
Heat tesistant Polymer
