摘要
热界面材料通常用于降低电子器件中固体界面的热阻。热界面材料的性质,如热导率、界面材料与固体表面间的接触热阻,对于电子器件的散热分析非常重要。然而,这些参数通常难以获得。依据ASTM D-5470测试标准,搭建了一个热界面测试系统。通过该系统测试了硅油和导热硅脂的热导率,以及它们与固体基板间的接触热阻。经分析,测试热导率和接触热阻的相对误差分别小于11.3%和41.3%。
Thermal interface materials (TIMs) are generally used to reduce the thermal resistance between contacting surfaces in electronic devices. The thermal properties of these materials, such as thermal conductivity (kTIM) and contact resistance (Rc) at the TIM-solid interface, are critical to the heat dissipation analysis. However, it is much difficult to obtain these data. In this paper, an experimental apparatus for TIMs thermal properties measurements is built based on ASTM test standard D-5470. Using this apparatus,kTIMand Rc of the silicone oil and thermal greases are measured, respectively. According to the error analysis, the relative errors in the measurement ofkTIMand Rc are less than 11.3% and 41.3%, respectively.
出处
《化工学报》
EI
CAS
CSCD
北大核心
2015年第S1期349-353,共5页
CIESC Journal
基金
国家重点基础研究发展计划项目(2011CB013105)~~
关键词
测量
界面
热传导
热导率
接触热阻
measurement
interface
heat conduction
thermal conductivity
contact resistance
