摘要
随着科学技术的不断发展,电子产品向便携式、小型化、高性能化方向发展,封装质量的好坏将直接影响到电子产品成本及性能,采用等离子清洗去除材料表面污染物提高表面活性,进而提高封装质量已变成封装中不可缺少的工艺过程。批量式等离子清洗设备由于在封装工艺中自身的局限性,正逐步被在线式所取代。本文对一种在线式等离子清洗设备进行了整线匹配性研究设计,提出了大幅提高清洗效果及产能的有效解决方案。
With the development of science and technology, Electronic product development direction is more portable, miniaturization and high performance, the quality of the package will directly affect the cost and performance of electronic products,The use of plasma cleaning to remove surface contamination of materials to improve the surface activity, and thus improve the packaging quality has become an indispensable process in the packaging process.Batch plasma cleaning equipment in the packaging process due to its limitations, is gradually being replaced by on-line plasma cleaning equipment.In this paper, a kind of on-line plasma cleaning equipment is designed for the whole line matching. An effective solution to improve the cleaning effect and capacity is put forward.
出处
《国防制造技术》
2016年第2期9-13,共5页
Defense Manufacturing Technology
关键词
等离子清洗
在线式等离子清洗设备
整线匹配
产能
plasma cleaning
on-line plasma cleaning machine
the whole line matching
capacity
