摘要
在对射频微波功率放大器芯片的概念、类型与实现工艺进行全面综述与分类的基础上,聚焦其高频化、线性度改善、能量转换效率提升、带宽扩展以及高集成度封装等关键技术的研究现状与亟待解决的技术问题,深入分析并讨论了各项关键技术的主流实现方式、典型研发案例以及相关应用利弊,旨在为现代无线通信系统射频前端集成的功率放大器芯片研发提供方法总结与设计参考。最后对射频微波功率放大器芯片技术的发展趋势与行业走向作出了展望。
Based on the comprehensive review and classification of the concepts,types,and realization processes of radio frequency/microwave power amplifier chips,this paper focus on the research status and urgent technical problems of key techniques such as high frequency,linearity improvement,energy conversion efficiency improvement,bandwidth expansion,highly integrated packaging and so on.The mainstream realization of each key technology,typical cases of research and development,as well as the advantages and disadvantages of the relevant applications,are also analyzed and discussed,targeting to summarize the methodology and provide design reference for the research and development of radio frequency front-end integrated power amplifier chips for modern wireless communication systems.Finally,the development trend and industry trend of radio frequency/microwave power amplifier chip technology are prospeted.
作者
李镇兵
黄峻杰
张晋荣
贾世麟
付佳龙
吴祥睿
李钢
孙浩洋
文光俊
LI Zhenbing;HUANG Junjie;ZHANG Jinrong;JIA Shilin;FU Jialong;WU Xiangrui;LI Gang;SUN Haoyang;WEN Guangjun(School of Information and Communication Engineering,University of Electronic Science and Technology of China,Chengdu 611731,China;School of Information and Software Engineering,University of Electronic Science and Technology of China,Chengdu 610054,China)
出处
《电子科技大学学报》
EI
CAS
CSCD
北大核心
2024年第6期871-882,共12页
Journal of University of Electronic Science and Technology of China
基金
国家重点研发项目(2018AAA0103203)
四川省科技计划项目(2021YFH0133,2022YFG0230,2023YFG0040)
中国移动研究院与X-NET联合项目(2022H002)
四川省智能终端重点实验室基金项目(SCITLAB-1015)。
关键词
射频微波
功率放大器芯片
高频化
效率提升
线性度改善
带宽扩展
高集成度封装
radio frequency/microwave
power amplifier chip
high frequency
efficiency improvement
linearity improvement
bandwidth expansion
high integration packaging
