摘要
随着集成电路高集成度、高性能的发展,对半导体制造技术提出更高要求。超短脉冲激光加工作为一种精密制造技术,正逐步成为半导体制造的重要工艺。阐述了超短脉冲激光加工技术特点和激光与材料相互作用过程,重点介绍了超快激光精密加工技术在硬脆半导体晶体切割、半导体晶圆划片中的应用,并提出相关技术提升方向。
With the development of integrated circuits with high integration and high performance,higher requirements are put forward for semiconductor manufacturing technology.As a precision manufacturing technology,ultrashort pulse laser processing is becoming an important process in semiconductor manufacturing.The characteristics of ultrashort pulse laser processing and the interaction between laser and materials are expounded.The application in hard-and-brittle semiconductor crystal slicing and semiconductor wafer dicing is introduced,and the direction of improving correlation technique are proposed.
作者
张彩云
胡北辰
张志耀
ZHANG Caiyun;HU Beichen;ZHANG Zhiyao(The 2nd Research Institute of CETC,Taiyuan 030024,China)
出处
《电子工艺技术》
2024年第6期1-4,共4页
Electronics Process Technology
基金
国家重点研发计划项目(2023YFB4606300)
科研计划项目(JCKY2022210C006)
山西省重大专项(202201030201007)。
关键词
超短脉冲激光
激光加工
半导体制造
晶体切割
晶圆划切
ultrashort pulse laser
laser processing
semiconductor manufacturing
crystal cut
wafer dicing
